PBSS4032ND: 30 V, 3.5 A NPN low VCEsat (BISS) transistor
NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a small SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package. PNP complement: PBSS4032PD
SOT457
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 30 V, 3.5 A NPN low V_CEsat (BISS) transistor (REV 1.0) PDF (150.0 kB) PBSS4032ND | 03 Feb 2010 |
Application Notes (3)
| Name/Description | Modified Date |
|---|---|
| Low VCEsat transistors in medium power loadswitch applications (REV 2.0) PDF (252.0 kB) AN10909 | 14 Mar 2013 |
| Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN11045 | 04 Mar 2013 |
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 | 12 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 | 30 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSS4032ND NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS4032ND_1 | 31 Jan 2015 |
| PBSS4032ND NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS4032ND_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 | 03 Jun 2013 |
SPICE model
- PBSS4032ND SPICE model (REV 1.4) prm PBSS4032ND_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | transistor polarity | Transistor polarity | Ptot [max] (mW) | number of transistors | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS4032ND | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | NPN | 480 | 1 | 30 | 3.5 | 6 | 300 | 500 | 135 | 50 | 300 | 75 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS4032ND | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PBSS4032ND,115 (9340 633 99115) | ZF | PBSS4032ND |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Low VCEsat transistors in medium power loadswitch applications PBSS4041SPN
- Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS4032ND NXP® Product Reliability PBSS4032ND
- PBSS4032ND NXP Product Quality PBSS4032ND
- MAR_SOT457 Topmark 74LVC2G17_Q100
- PBSS4032ND SPICE model PBSS4032ND
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- SSL5021_SSL5031
