PBSS4160DS: 60 V, 1 A NPN/NPN low VCEsat (BISS) transistor _ BDTIC a Leading Distributor in China

PBSS4160DS: 60 V, 1 A NPN/NPN low VCEsat (BISS) transistor

NPN/NPN low VCEsat Breakthrough In Small Signal (BISS) transistor pair in a SOT457 (SC-74) Surface Mounted Device (SMD) plastic package.

PNP/PNP complement: PBSS5160DS.

PBSS4160DS: Product Block Diagram

PBSS4160DS: Block Diagram

SOT457

Data Sheets (1)

Name/Description	Modified Date
60 V, 1 A NPN/NPN low VCEsat (BISS) transistor (REV 4.0) PDF (208.0 kB) PBSS4160DS	25 Jan 2010

Application Notes (1)

Name/Description	Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076	12 Jul 2011

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457	08 Feb 2016

Packing (3)

Name/Description	Modified Date
TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115	30 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125	30 Nov 2012
TSOP6; reel pack; reversed product orientation; 12NC ending 165 (REV 1.0) PDF (187.0 kB) SOT457_165	30 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
PBSS4160DS NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS4160DS_1	31 Jan 2015
PBSS4160DS NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS4160DS_NXP_PRODUCT_QUALITY	31 Jan 2015

Supporting Information (3)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE	30 Sep 2013
MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457	03 Jun 2013

SPICE model

PBSS4160DS SPICE model (REV 1.4) prm PBSS4160DS_1_2 7/22/2012

Ordering Information

Product	Status	Package version	Package name	Size (mm)	transistor polarity	Transistor polarity	Polarity	P_tot [max] (mW)	number of transistors	V_CEO [max] (V)	I_C [max] (A)	I_CM [max] (A)	h_FE [min]	V_CEsat [max] (NPN) (mV)	h_FE [typ]	f_T [typ] (MHz)	R_CEsat@I_C [max]; I_C/I_B =10 [typ] (mΩ)	f_T [min] (MHz)	R_CEsat [typ] (mΩ)	V_CEsat [max] (mV)	R_CEsat [max] (mΩ)
PBSS4160DS	Active	SOT457	TSOP6	2.9 x 1.5 x 1	NPN		NPN	420	2	60	0.87	2	250	250	500	220	250	150	200	250	250

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
PBSS4160DS		SOT457	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 13" Q3/T4 in LargePack, Reverse	Active	PBSS4160DSZ (9340 581 15165)	B8	PBSS4160DS		Always Pb-free	153.0	0.71	1.41E9	1	1
				Reel 7" Q3/T4, Reverse	Active	PBSS4160DSH (9340 581 15125)	B8	PBSS4160DS		Always Pb-free	153.0	0.71	1.41E9	1	1
				Reel 7" Q1/T1	Active	PBSS4160DS,115 (9340 581 15115)	B8	PBSS4160DS		Always Pb-free	153.0	0.71	1.41E9	1	1

60 V, 1 A NPN/NPN low VCEsat (BISS) transistor PBSS4160DS

Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z

PBSS4160DS NXP® Product Reliability PBSS4160DS

PBSS4160DS NXP Product Quality PBSS4160DS

MAR_SOT457 Topmark 74LVC2G17_Q100

PBSS4160DS SPICE model PBSS4160DS

plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

TSOP6; reel pack; reversed product orientation; 12NC ending 165 bza456a

Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100

TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud

PESDXS5UD_SERIES

PBSS4160DS

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