PBSS4330X: 30 V, 3 A NPN low VCEsat (BISS) transistor
NPN low VCEsat transistor in a SOT89 plastic package.
PBSS4330X: Product Block Diagram
PBSS4330X: Block Diagram
SOT089
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 30 V, 3 A NPN low VCEsat (BISS) transistor (REV 3.0) PDF (187.0 kB) PBSS4330X | 06 Dec 2004 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 | 12 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 | 28 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 | 28 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSS4330X NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS4330X_1 | 31 Jan 2015 |
| PBSS4330X NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS4330X_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
SPICE model
- PBSS4330X SPICE model (REV 1.4) prm PBSS4330X_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Transistor polarity | transistor polarity | Ptot [max] (mW) | number of transistors | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [min] (MHz) | fT [typ] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS4330X | Active | SOT89 | SOT89 | 4.5 x 2.5 x 1.5 | NPN | 550 | 1 | 30 | 3 | 5 | 300 | 100 | 80 | 300 | 100 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS4330X | | SOT89 | Reel 11¼" Q1/T1 in LargePack | Active | PBSS4330X,135 (9340 580 36135) | %1R | PBSS4330X |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | |
| Reel 7" Q1/T1 | Active | PBSS4330X,115 (9340 580 36115) | %1R | PBSS4330X | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS4330X NXP® Product Reliability PBSS4330X
- PBSS4330X NXP Product Quality PBSS4330X
- PBSS4330X SPICE model PBSS4330X
- plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
- Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
- Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
- BZV49_SERIES
- PBSS8110X
- BFU590Q
