PBSS4350T: 50 V; 3 A NPN low VCEsat (BISS) transistor _ BDTIC a Leading Distributor in China

PBSS4350T: 50 V; 3 A NPN low VCEsat (BISS) transistor

NPN low VCEsat transistor in a SOT23 plastic package. PNP complement: PBSS5350T.

PBSS4350T: Product Block Diagram

SOT023

Data Sheets (1)

Name/Description	Modified Date
50 V; 3 A NPN low VCEsat (BISS) transistor (REV 2.0) PDF (338.0 kB) PBSS4350T	09 Jan 2004

Application Notes (3)

Name/Description	Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076	12 Jul 2011
Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405	06 Jan 2006
BISS transistors and MEGA Schottky rectifiers - improved technologies for discrete semiconductors (REV 1.0) PDF (236.0 kB) AN10393	01 Sep 2005

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23	08 Feb 2016

Packing (2)

Name/Description	Modified Date
Tape reel SMD; standard product orientation 12NC ending 235 (REV 2.0) PDF (199.0 kB) SOT23_235	05 Feb 2013
Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215	16 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
PBSS4350T NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS4350T_1	31 Jan 2015
PBSS4350T NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS4350T_NXP_PRODUCT_QUALITY	31 Jan 2015

Supporting Information (2)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE	30 Sep 2013

SPICE model

PBSS4350T SPICE model (REV 1.4) prm PBSS4350T_1_2_3 7/22/2012

Software

PBSS4350T_1_2_3_4 (REV 0.1) olb PBSS4350T_1_2_3_4 11/21/2008

Ordering Information

Product	Status	Package version	Package name	Size (mm)	Transistor polarity	transistor polarity	number of transistors	P_tot [max] (mW)	V_CEO [max] (V)	I_C [max] (A)	I_CM [max] (A)	h_FE [min]	h_FE [typ]	f_T [typ] (MHz)	f_T [min] (MHz)	R_CEsat [typ] (mΩ)	V_CEsat [max] (mV)	R_CEsat [max] (mΩ)
PBSS4350T	Active	SOT23	TO-236AB	2.9 x 1.3 x 1		NPN	1	300	50	2	5	300			100	100	370	130
PBSS4350T/G	No Longer Manufactured	SOT23	TO-236AB	2.9 x 1.3 x 1		NPN		300	50	2	5	300				100	370
PBSS4350T/DG	No Longer Manufactured	SOT23	TO-236AB	2.9 x 1.3 x 1		NPN		300	50	2	5	300				100	370

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
PBSS4350T		SOT23	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q3/T4	Active	PBSS4350T,215 (9340 566 04215)	ZC%	PBSS4350T		week 34, 2003	153.0	0.71	1.41E9	1	1
PBSS4350T		SOT23		Reel 11" Q3/T4, LargePack	Active	PBSS4350TVL (9340 566 04235)	ZC%	PBSS4350T		Always Pb-free	153.0	0.71	1.41E9	1	1

50 V; 3 A NPN low VCEsat (BISS) transistor PBSS4350T

Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z

Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16

BISS transistors and MEGA Schottky rectifiers - improved technologies for discrete semiconductors PMEG6010AED

PBSS4350T NXP® Product Reliability PBSS4350T

PBSS4350T NXP Product Quality PBSS4350T

PBSS4350T SPICE model PBSS4350T

PBSS4350T_1_2_3_4 PBSS4350T

plastic surface-mounted package; 3 leads BSS84AK

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK

Tape reel SMD; standard product orientation 12NC ending 235 BSS84AK

PMMT491A

PMBFJ309

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