PBSS5130T: 30 V; 1 A PNP low VCEsat (BISS) transistor
PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a small SOT23 Surface-Mounted Device (SMD) plastic package.
SOT023
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 30 V; 1 A PNP low VCEsat (BISS) transistor (REV 2.0) PDF (198.0 kB) PBSS5130T | 09 Jul 2013 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 | 12 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSS5130T NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS5130T_1 | 31 Jan 2015 |
| PBSS5130T NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5130T_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PBSS5130T SPICE model (REV 1.4) prm PBSS5130T_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | transistor polarity | Transistor polarity | number of transistors | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | fT [min] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5130T | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | PNP | 1 | 300 | -30 | -1 | -3 | 300 | 450 | 200 | 100 | -100 | 220 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5130T | | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | PBSS5130T,215 (9340 579 88215) | > | PBSS5130T |    | week 34, 2003 | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS5130T NXP® Product Reliability PBSS5130T
- PBSS5130T NXP Product Quality PBSS5130T
- PBSS5130T SPICE model PBSS5130T
- plastic surface-mounted package; 3 leads BSS84AK
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 215 BSS84AK
- PMBFJ309
