PBSS5230PAP: 30 V, 2 A PNP/PNP low VCEsat (BISS) transistor

PNP/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package.

NPN/PNP complement: PBSS4230PANP. NPN/NPN complement: PBSS4230PAN.

-
Data Sheets (1)
Name/DescriptionModified Date
30 V, 2 A PNP/PNP low VCEsat (BISS) transistor (REV 1.0) PDF (269.0 kB) PBSS5230PAP11 Jan 2013
Package Information (1)
Name/DescriptionModified Date
DFN2020-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (198.0 kB) SOT111808 Feb 2016
Packing (1)
Name/DescriptionModified Date
DFN2020-6; reel pack; standard orientation; 12NC ending 115 (REV 1.0) PDF (196.0 kB) SOT1118_11507 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
PBSS5230PAP NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS5230PAP_131 Jan 2015
PBSS5230PAP NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5230PAP_NXP_PRODUCT_QUALITY31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)transistor polarityTransistor polarityPolaritynumber of transistorsPtot [max] (mW)ICM [max] (A)VCEO [max] (V)IC [max] (A)hFE [typ]VCEsat [max] (NPN) (mV)VCEsat [max] (PNP) (mV)RCEsat@IC [max]; IC/IB =10 [typ] (mΩ)fT [min] (MHz)RCEsat [typ] (mΩ)hFE [min]VCEsat [max] (mV)fT [typ] (MHz)RCEsat [max] (mΩ)
PBSS5230PAPActiveSOT1118DFN2020-62 x 2 x 0.65PNPPNP2370-3-30-2370-390195.0000000000000150260-11095195
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PBSS5230PAPSOT1118Reflow_Soldering_ProfileReel 7" Q1/T1ActivePBSS5230PAP,115 (9340 668 84115)2HPBSS5230PAPAlways Pb-free153.00.711.41E911
30 V, 2 A PNP/PNP low VCEsat (BISS) transistor PBSS5230PAP
PBSS5230PAP NXP® Product Reliability PBSS5230PAP
PBSS5230PAP NXP Product Quality PBSS5230PAP
PBSS5230PAP SPICE model PBSS5230PAP
DFN2020-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm PBSS5260PAP
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-6; reel pack; standard orientation; 12NC ending 115 PBSS5260PAP
PMFPB8040XP