PBSS5260PAP: 60 V, 2 A PNP/PNP low VCEsat (BISS) transistor
PNP high power bipolar transistor in a SOT669 (LFPAK56) Surface-Mounted Device (SMD) power plastic package.
NPN complement: PHPT61002NYC.
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Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 60 V, 2 A PNP/PNP low VCEsat (BISS) transistor (REV 1.0) PDF (248.0 kB) PBSS5260PAP | 12 Dec 2012 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (198.0 kB) SOT1118 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020-6; reel pack; standard orientation; 12NC ending 115 (REV 1.0) PDF (196.0 kB) SOT1118_115 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSS5260PAP NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS5260PAP_1 | 31 Jan 2015 |
| PBSS5260PAP NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5260PAP_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PBSS5260PAP SPICE model (REV 1.0) prm PBSS5260PAP_1_2 3/22/2013
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Transistor polarity | transistor polarity | Polarity | number of transistors | Ptot [max] (mW) | ICM [max] (A) | VCEO [max] (V) | IC [max] (A) | hFE [typ] | VCEsat [max] (NPN) (mV) | VCEsat [max] (PNP) (mV) | RCEsat@IC [max]; IC/IB =10 [typ] (mΩ) | RCEsat [typ] (mΩ) | fT [min] (MHz) | hFE [min] | VCEsat [max] (mV) | fT [typ] (MHz) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5260PAP | Active | SOT1118 | DFN2020-6 | 2 x 2 x 0.65 | PNP | PNP | 2 | 370 | -3 | -60 | -2 | 250 | -500 | 250 | 50 | 170 | -140 | 100 | 250 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS5260PAP | | SOT1118 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PBSS5260PAP,115 (9340 668 91115) | 2P | PBSS5260PAP |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- 60 V, 2 A PNP/PNP low VCEsat (BISS) transistor PBSS5260PAP
- PBSS5260PAP NXP® Product Reliability PBSS5260PAP
- PBSS5260PAP NXP Product Quality PBSS5260PAP
- PBSS5260PAP SPICE model PBSS5260PAP
- DFN2020-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm PBSS5260PAP
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020-6; reel pack; standard orientation; 12NC ending 115 PBSS5260PAP
- PMFPB8040XP
