PBSS5330PA: 30 V, 3 A PNP low VCEsat (BISS) transistor

PNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.

NPN complement: PBSS4330PA.

Outline 3d SOT1061
Data Sheets (1)
Name/DescriptionModified Date
30 V, 3 A PNP low VCEsat (BISS) transistor (REV 2.0) PDF (218.0 kB) PBSS5330PA [English]07 Apr 2015
Application Notes (3)
Name/DescriptionModified Date
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN11045 [English]04 Mar 2013
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
Protecting charger interfaces and typical battery charging topologies with external bypass transistors (REV 2.0) PDF (204.0 kB) AN10910 [English]01 Jul 2011
Brochures (2)
Name/DescriptionModified Date
适用于便携设备和移动电话... (REV 1.0) PDF (4.9 MB) 939775017444_ZH [English]28 Oct 2013
Discretes for portable devices and mobile handsets (REV 1.1) PDF (3.9 MB) 939775017444 [English]04 Sep 2013
Package Information (1)
Name/DescriptionModified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English]08 Feb 2016
Packing (2)
Name/DescriptionModified Date
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English]07 Nov 2012
DFN2020-3; Standard orientation; 12NC ending 135 (REV 1.0) PDF (261.0 kB) SOT1061_135 [English]07 Nov 2012
Reliability and Quality Information (1)
Name/DescriptionModified Date
PBSS5330PA NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS5330PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)transistor polarityTransistor polaritynumber of transistorsPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [min] (MHz)fT [typ] (MHz)RCEsat [typ] (mΩ)RCEsat [max] (mΩ)VCEsat [max] (mV)
PBSS5330PAActiveSOT1061DFN2020-32 x 2 x 0.65PNP12100-30-3-520032010016575107-320
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PBSS5330PASOT1061Reflow_Soldering_ProfileReel 11¼" Q1/T1 in LargePackActivePBSS5330PA,135 (9340 642 73135)AJPBSS5330PAAlways Pb-free153.00.711.41E911
Reel 7" Q1/T1ActivePBSS5330PA,115 (9340 642 73115)AJPBSS5330PAAlways Pb-free153.00.711.41E911
30 V, 3 A PNP low VCEsat (BISS) transistor PBSS5330PA
Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
Protecting charger interfaces and typical battery charging topologies with external bypass transistors prtr5v0u2f
适用于便携设备和移动电话... ptvsxs1ur_automotive
Discretes for portable devices and mobile handsets ptvsxs1ur_automotive
PBSS5330PA NXP Product Quality PBSS5330PA
PBSS5330PA SPICE model PBSS5330PA
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; Standard orientation; 12NC ending 135 PMEG6020EPA
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
PTVSXU1UPA_SERIES