The PCA9620 is a peripheral device which interfaces to almost any Liquid Crystal Display (LCD) with low multiplex rates. It generates the drive signals for any static or multiplexed LCD containing up to eight backplanes, 60 segments, and up to 480 elements. The PCA9620 is compatible with most microprocessors or microcontrollers and communicates via a two-line bidirectional I²C-bus. Communication overheads are minimized using a display RAM with auto-incremented addressing and display memory switching. The PCA9620 features an internal charge pump with internal capacitors for on-chip generation of the LCD driving voltages.
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60 x 8 LCD high-drive segment driver for automotive and industrial (REV 4.0) PDF (719.0 kB) PCA9620 | 08 Apr 2015 |
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EMC and system level ESD design guidelines for LCD drivers (REV 1.0) PDF (910.0 kB) AN11267 | 06 Mar 2015 |
Design guidelines for COG modules with NXP® monochrome LCD drivers (REV 4.0) PDF (205.0 kB) AN10170 | 04 Aug 2014 |
ESD and EMC sensitivity of IC (REV 1.0) PDF (745.0 kB) AN10853 | 14 Mar 2013 |
Handling bare die (REV 2.0) PDF (1.6 MB) AN10706 | 16 Jun 2011 |
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Store and transport requirements (REV 3.0) PDF (325.0 kB) UM10569 | 10 Mar 2015 |
OM13500 & OM13500A, PCA9620 & PCx8537 demo board (REV 1.0) PDF (493.0 kB) UM10744 | 06 Mar 2015 |
The NXP® LCD driver with on-chip charge pump for the LCD supply voltage generation (REV 1.0) PDF (92.0 kB) UM10782 | 06 Mar 2015 |
I2C-bus specification and user manual (REV 6.0) PDF (1.4 MB) UM10204 | 28 Apr 2014 |
I2C-bus specification and user manual (REV 5.0) PDF (1.6 MB) UM10204_JA | 03 Apr 2013 |
I2C Demonstration Board 2005-1 Quick Start Guide (REV 1.0) PDF (261.0 kB) UM10206 | 13 Jun 2006 |
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NXP® I2C-bus solutions 2014: Smart, simple solutions for the 12 most common design concerns (REV 1.0) PDF (3.5 MB) 75017540 | 01 Aug 2014 |
NXP® 60 x 8 LCD segment driver PCA9620 for automotive & industrial (REV 1.0) PDF (372.0 kB) 75017118 | 10 May 2011 |
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Chip-On-Glass (COG) - a cost-effective and reliable technology for LCD displays (REV 2.0) PDF (1.2 MB) R_10015_1 | 12 Apr 2016 |
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Bare die; 80 bonding pads (REV 1.0) PDF (148.0 kB) OL-PCA9620U | 10 Feb 2016 |
plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm (REV 1.0) PDF (605.0 kB) SOT315-1 | 08 Feb 2016 |
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Footprint for wave soldering (REV 1.0) PDF (11.0 kB) HTQFP-HLQFP-LQFP-MSQFP-WAVE | 08 Oct 2009 |
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Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PCA9620H/Q900/1 | SOT315-1 | HTQFP-HLQFP-LQFP-MSQFP-WAVE | Reel 13" Q1/T1 in Drypack | Active | PCA9620H/Q900/1,51 (9352 918 99518) | PCA9620H/Q900 | PCA9620H/Q900/1 | Always Pb-free | 5 | 2E8 | 2 | 2 | ||
PCA9620U/5GA/Q1 | OL-PCA9620U | Wafer, unmeasured | Active | PCA9620U/5GA/Q1,01 (9352 958 01015) | Standard Marking | PCA9620U/5GA/Q1 | Always Pb-free | 5 | 2E8 | NA | NA |