PNP Resistor-Equipped Transistor (RET) in a leadless ultra small SOT883B Surface-Mounted Device (SMD) plastic package. NPN complement: PDTC143XMB.
Name/Description | Modified Date |
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PNP resistor-equipped transistor; R1 = 4.7 kOhm, R2 = 10 kOhm (REV 1.0) PDF (716.0 kB) PDTA143XMB [English] | 13 Jun 2012 |
Name/Description | Modified Date |
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DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B [English] | 08 Feb 2016 |
Name/Description | Modified Date |
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Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_315 [English] | 22 Jul 2016 |
Name/Description | Modified Date |
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PDTA143XMB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PDTA143XMB_1 [English] | 31 Jan 2015 |
PDTA143XMB NXP Product Quality (REV 1.2) PDF (74.0 kB) PDTA143XMB_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | IC [max] (mA) | R1 (typ) (kΩ) | R2 (typ) (kΩ) | channel type | Ptot (mW) | VCEO (V) |
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PDTA143XMB | Active | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | 100 | 4.7 | 10 | PNP | 250 | 50 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PDTA143XMB | SOT883B | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PDTA143XMB,315 (9340 660 55315) | 0010 1001 | PDTA143XMB | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |