NPN Resistor-Equipped Transistor (RET) family in Surface-Mounted Device (SMD) plastic packages.
Name/Description | Modified Date |
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NPN resistor-equipped transistors; R1 = 10kOhm, R2 = 47kOhm (REV 7.0) PDF (747.0 kB) PDTC114Y_SER | 09 Dec 2011 |
Name/Description | Modified Date |
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DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 | 08 Feb 2016 |
Name/Description | Modified Date |
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Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 | 22 Jul 2016 |
Name/Description | Modified Date |
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PDTC114YM NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PDTC114YM | 31 Jan 2015 |
PDTC114YM NXP Product Quality (REV 1.2) PDF (74.0 kB) PDTC114YM_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | channel type | Ptot (mW) | R2 (typ) (kΩ) | IC [max] (mA) | R1 (typ) (kΩ) | VCEO (V) |
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PDTC114YM | Active | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | NPN | 250 | 47 | 100 | 10 | 50 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PDTC114YM | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PDTC114YM,315 (9340 571 72315) | DU | PDTC114YM | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |