NPN/PNP double Resistor-Equipped Transistors (RET) in Surface-Mounted Device (SMD) plastic packages.
Name/Description | Modified Date |
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NPN/PNP resistor-equipped transistors; R1 = 10 kOhm, R2 = 47 kOhm (REV 6.0) PDF (920.0 kB) PEMD9_PUMD9 | 08 Dec 2011 |
Name/Description | Modified Date |
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plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666 | 08 Feb 2016 |
Name/Description | Modified Date |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115 | 29 Nov 2012 |
Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (180.0 kB) SOT666_315 | 29 Nov 2012 |
Name/Description | Modified Date |
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PEMD9 NXP Product Quality (REV 1.2) PDF (74.0 kB) PEMD9_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
PEMD9 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PEMD9_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | channel type | Ptot (mW) | R2 (typ) (kΩ) | IC [max] (mA) | R1 (typ) (kΩ) | VCEO (V) |
---|---|---|---|---|---|---|---|---|---|---|
PEMD9 | Active | SOT666 | SOT666 | 1.6 x 1.2 x 0.55 | NPN/PNP | 300 | 47 | 100 | 10 | 50 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PEMD9 | SOT666 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PEMD9,315 (9340 567 06315) | D9 | PEMD9 | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 | ||
Reel 7" Q1/T1 | Active | PEMD9,115 (9340 567 06115) | D9 | PEMD9 | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |