PESD24VS1ULD: Unidirectional ESD protection diode

Unidirectional ElectroStatic Discharge (ESD) protection diode designed to protect one signal line from the damage caused by ESD and other transients. The device is housed in a SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

-
Data Sheets (1)
Name/DescriptionModified Date
Unidirectional ESD protection diode (REV 1.0) PDF (292.0 kB) PESD24VS1ULD22 Oct 2010
Brochures (2)
Name/DescriptionModified Date
NXP® SOD882D package, First leadless package with tin-plated, solderable side pads (REV 2.0) PDF (1.8 MB) 7501713006 Jun 2011
The first leadless package with solderable side pads (REV 1.0) PDF (228.0 kB) POSTER_SOD882D21 Oct 2010
Package Information (1)
Name/DescriptionModified Date
DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D08 Feb 2016
Reliability and Quality Information (2)
Name/DescriptionModified Date
PESD24VS1ULD NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD24VS1ULD_131 Jan 2015
PESD24VS1ULD NXP Product Quality (REV 1.2) PDF (74.0 kB) PESD24VS1ULD_NXP_PRODUCT_QUALITY31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD24VS1ULDActiveSOD882DDFN1006D-21 x 0.6 x 0.41Unidirectional235024230.05
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PESD24VS1ULDSOD882DReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePESD24VS1ULD,315 (9340 649 57315)0010 0000PESD24VS1ULDAlways Pb-free117.00.541.85E911
Unidirectional ESD protection diode pesd24vs1uld
NXP® SOD882D package, First leadless package with tin-plated, solderable side pads pesd5v0s1uld
The first leadless package with solderable side pads pesd5v0s1uld
PESD24VS1ULD NXP® Product Reliability pesd24vs1uld
PESD24VS1ULD NXP Product Quality pesd24vs1uld
PESD24VS1ULD SPICE model PESD24VS1ULD
DFN1006D-2: leadless ultra small plastic package; 2 terminals pesd5v0x1uld
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
BB187LX