PESD3V3L4UF: Low capacitance unidirectional quadruple ESD protection diode arrays
Low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection diode arrays in small Surface-Mounted Device (SMD) plastic packages designed to protect up to four signal lines from the damage caused by ESD and other transients.
Outline 3d SOT886
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Low capacitance unidirectional quadruple ESD protection diode arrays (REV 4.0) PDF (111.0 kB) PESDXL4UF_G_W | 28 Feb 2008 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 | 30 Dec 2010 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 | 23 Apr 2013 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD3V3L4UF NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3L4UF | 31 Jan 2015 |
| PESD3V3L4UF NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3L4UF_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 | 03 Jun 2013 |
SPICE model
- PESD3V3L4UF SPICE model (REV 1.4) prm PESD3V3L4UF_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD3V3L4UF | Active | SOT886 | XSON6 | 1.45 x 1 x 0.5 | 4 | Unidirectional | 22 | 28 | 3.3 | 20 | 0.3 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD3V3L4UF | | SOT886 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PESD3V3L4UF,115 (9340 611 94115) | A5 | PESD3V3L4UF |    | Always Pb-free | 244.0 | 1.13 | 8.85E8 | 1 | 1 |
- MicroPak soldering information NTS0102_Q100
- PESD3V3L4UF NXP® Product Reliability pesd3v3l4uf
- PESD3V3L4UF NXP® Product Quality pesd3v3l4uf
- MAR_SOT886 Topmark prtr5v0u2f
- PESD3V3L4UF SPICE model PESD3V3L4UF
- XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f
- BGU8007
