PESD3V3L5UY: Low capacitance unidirectional fivefold ESD protection diode arrays
Low capacitance unidirectional fivefold ElectroStatic Discharge (ESD) protection diode arrays in small Surface-Mounted Device (SMD) plastic packages designed to protect up to five unidirectional signal lines from the damage caused by ESD and other transients.
SOT363
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Low capacitance unidirectional fivefold ESD protection diode arrays (REV 2.0) PDF (106.0 kB) PESDXL5UF_V_Y | 08 Jan 2008 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 | 15 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD3V3L5UY NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3L5UY | 31 Jan 2015 |
| PESD3V3L5UY NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3L5UY_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 | 03 Jun 2013 |
SPICE model
- PESD3V3L5UY SPICE model (REV 1.4) prm PESD3V3L5UY_1_2 7/22/2012
Software
- PESD3V3L5UY_1_2_3 (REV 0.1) olb PESD3V3L5UY_1_2_3 11/21/2008
- PESD5V0L5UY_1_2_3 (REV 0.1) olb PESD5V0L5UY_1_2_3 11/21/2008
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD3V3L5UY | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | 5 | Unidirectional | 22 | 28 | 3.3 | 20 | 0.3 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD3V3L5UY | | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PESD3V3L5UY,115 (9340 578 02115) | K3% | PESD3V3L5UY |    | Always Pb-free | 244.0 | 1.13 | 8.85E8 | 1 | 1 |
- PESD3V3L5UY NXP® Product Reliability pesd3v3l5uy
- PESD3V3L5UY NXP® Product Quality pesd3v3l5uy
- MAR_SOT363 Topmark BSS84AKS
- PESD3V3L5UY SPICE model PESDXL5UF_PESDXL5UV_PESDXL5UY
- PESD3V3L5UY_1_2_3 PESDXL5UF_PESDXL5UV_PESDXL5UY
- PESD5V0L5UY_1_2_3 PESDXL5UF_PESDXL5UV_PESDXL5UY
- plastic surface-mounted package; 6 leads BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- BFU520Y
