PESD3V3S4UD: Quadruple ESD protection diode arrays in a SOT457 package
Quadruple ElectroStatic Discharge (ESD) protection diode arrays in a SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package designed to protect up to 4 signal lines from the damage caused by ESD and other transients.
PESD3V3S4UD: Product Block Diagram
PESD3V3S4UD: Block Diagram
SOT457
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Quadruple ESD protection diode arrays in a SOT457 package (REV 2.0) PDF (96.0 kB) PESDXS4UD_SER | 03 Sep 2009 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| Application guide: ESD protection (REV 1.0) PDF (11.5 MB) 75017664 | 03 Jul 2015 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 | 30 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD3V3S4UD NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3S4UD | 31 Jan 2015 |
| PESD3V3S4UD NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3S4UD_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 | 03 Jun 2013 |
SPICE model
- PESD3V3S4UD SPICE model (REV 1.4) prm PESD3V3S4UD_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD3V3S4UD | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 4 | Unidirectional | 215 | 300 | 3.3 | 30 | 0.8 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD3V3S4UD | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PESD3V3S4UD,115 (9340 593 01115) | K4 | PESD3V3S4UD |    | Always Pb-free | 244.0 | 1.13 | 8.85E8 | 1 | 1 |
- Application guide: ESD protection prtr5v0u2x
- PESD3V3S4UD NXP® Product Reliability pesd3v3s4ud
- PESD3V3S4UD NXP® Product Quality pesd3v3s4ud
- MAR_SOT457 Topmark 74LVC2G17_Q100
- PESD3V3S4UD SPICE model PESDXS4UD_SERIES
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- PESDXS5UD_SERIES
- PESDXS4UD_SERIES
- SSL5021_SSL5031
