Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a leadless ultra small Surface-Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients.
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Ultra low capacitance bidirectional ESD protection diode (REV 1.0) PDF (85.0 kB) PESD3V3X1BL | 15 Jan 2009 |
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DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 | 07 Nov 2012 |
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PESD3V3X1BL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3X1BL_1 | 31 Jan 2015 |
PESD3V3X1BL NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3X1BL_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
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PESD3V3X1BL | Active | SOD882 | DFN1006-2 | 1.0 x 0.6 x 0.5 | 1 | Bidirectional | 1.3 | 1.6 | 3.3 | 9 | 0.1 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PESD3V3X1BL | SOD882 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD3V3X1BL,315 (9340 632 65315) | SS | PESD3V3X1BL | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |