Low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection diode arrays in small Surface-Mounted Device (SMD) plastic packages designed to protect up to four signal lines from the damage caused by ESD and other transients.
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Low capacitance unidirectional quadruple ESD protection diode arrays (REV 4.0) PDF (111.0 kB) PESDXL4UF_G_W | 28 Feb 2008 |
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plastic surface-mounted package; 5 leads (REV 1.0) PDF (245.0 kB) SOT353 | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (191.0 kB) SOT353_115 | 16 Nov 2012 |
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PESD5V0L4UG NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0L4UG | 31 Jan 2015 |
PESD5V0L4UG NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0L4UG_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
MAR_SOT353 Topmark (REV 1.0) PDF (103.0 kB) MAR_SOT353 | 03 Jun 2013 |
Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
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PESD5V0L4UG | Active | SOT353 | TSSOP5 | 2 x 1.25 x 0.95 | 4 | Unidirectional | 16 | 19 | 5 | 20 | 0.025 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PESD5V0L4UG | SOT353 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PESD5V0L4UG,115 (9340 577 85115) | L2% | PESD5V0L4UG | week 31, 2003 | 244.0 | 1.13 | 8.85E8 | 1 | 1 |