PESD5V0U1BA: Ultra low capacitance bidirectional ESD protection diodes
Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diodes in small Surface-Mounted Device (SMD) plastic packages designed to protect one data line from the damage caused by ESD.
PESD5V0U1BA: Product Block Diagram
PESD5V0U1BA: Block Diagram
PESD5V0U1BA: Block Diagram
sod323_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Ultra low capacitance bidirectional ESD protection diodes (REV 1.0) PDF (80.0 kB) PESD5V0U1BA_BB_BL | 25 Apr 2007 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| Application guide: ESD protection (REV 1.0) PDF (11.5 MB) 75017664 | 03 Jul 2015 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (200.0 kB) SOD323 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (183.0 kB) SOD323_115 | 07 Nov 2012 |
| Tape reel; standard product orientation 12NC ending 135 (REV 1.0) PDF (183.0 kB) SOD323_135 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD5V0U1BA NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0U1BA | 31 Jan 2015 |
| PESD5V0U1BA NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0U1BA_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PESD5V0U1BA SPICE model (REV 1.4) prm PESD5V0U1BA_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0U1BA | Active | SOD323 | SOD323 | 1.7 x 1.25 x 0.95 | 1 | Bidirectional | 2.9 | 3.5 | 5 | 10 | 0.1 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0U1BA | | SOD323 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PESD5V0U1BA,115 (9340 608 54115) | AA | PESD5V0U1BA |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
| Reel 11¼" Q1/T1 in LargePack | Active | PESD5V0U1BAF (9340 608 54135) | AA | PESD5V0U1BA | | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- Application guide: ESD protection prtr5v0u2x
- PESD5V0U1BA NXP® Product Reliability pesd5v0u1ba
- PESD5V0U1BA NXP® Product Quality pesd5v0u1ba
- PESD5V0U1BA SPICE model PESD5V0U1BA_BB_BL
- plastic surface-mounted package; 2 leads pesd5v0v1ba
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel; standard product orientation 12NC ending 115 pesd5v0v1ba
- Tape reel; standard product orientation 12NC ending 135 pesd5v0u1ba
- PESD5V0X1BL
- 1PSXSB17
- BB208-03
