PESD5V0U2BM: Ultra low capacitance bidirectional double ESD protection array
Ultra low capacitance bidirectional double ElectroStatic Discharge (ESD) protection diode array in a SOT883 (SC-101) leadless ultra small Surface-Mounted Device (SMD) plastic package designed to protect up to two signal lines from the damage caused by ESD and other transients.
PESD5V0U2BM: Product Block Diagram
PESD5V0U2BM: Block Diagram
SOT883
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Ultra low capacitance bidirectional double ESD protection array (REV 1.0) PDF (75.0 kB) PESD5V0U2BM | 14 Aug 2008 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 | 22 Jul 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD5V0U2BM NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0U2BM_1 | 31 Jan 2015 |
| PESD5V0U2BM NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0U2BM_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0U2BM | Active | SOT883 | DFN1006-3 | 1.0 x 0.6 x 0.5 | 2 | Bidirectional | 2.9 | 3.5 | 5 | 10 | 0.1 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0U2BM | | SOT883 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD5V0U2BM,315 (9340 619 47315) | GA | PESD5V0U2BM |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- PESD5V0U2BM NXP® Product Reliability pesd5v0u2bm
- PESD5V0U2BM NXP® Product Quality pesd5v0u2bm
- DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
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