PESD5V0U4BF: Ultra low capacitance bidirectional quadruple ESD protection arrays
Ultra low capacitance bidirectional quadruple ElectroStatic Discharge (ESD) protection arrays in ultra small Surface-Mounted Device (SMD) plastic packages designed to protect up to four signal lines from the damage caused by ESD and other transients.
PESD5V0U4BF: Product Block Diagram
PESD5V0U4BF: Block Diagram
PESD5V0U4BF: Block Diagram
PESD5V0U4BF: Block Diagram
Outline 3d SOT886
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Ultra low capacitance bidirectional quadruple ESD protection arrays (REV 1.0) PDF (83.0 kB) PESD5V0U4BF_PESD5V0U4BW | 15 Aug 2008 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 | 30 Dec 2010 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 | 23 Apr 2013 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD5V0U4BF NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0U4BF | 31 Jan 2015 |
| PESD5V0U4BF NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0U4BF_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 | 03 Jun 2013 |
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0U4BF | Active | SOT886 | XSON6 | 1.45 x 1 x 0.5 | 4 | Bidirectional | 2.9 | 3.5 | 5 | 10 | 0.1 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0U4BF | | SOT886 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PESD5V0U4BF,115 (9340 619 51115) | B1 | PESD5V0U4BF |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- MicroPak soldering information NTS0102_Q100
- PESD5V0U4BF NXP® Product Reliability pesd5v0u4bf
- PESD5V0U4BF NXP® Product Quality pesd5v0u4bf
- MAR_SOT886 Topmark prtr5v0u2f
- XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f
- PESD5V0U4BF_PESD5V0U4BW
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- PESD5V0U4BF_PESD5V0U4BW
- BGU8007
