Ultra low capacitance bidirectional fivefold ElectroStatic Discharge (ESD) protection arrays in ultra small Surface-Mounted Device (SMD) plastic packages designed to protect up to five signal lines from the damage caused by ESD and other transients.
Name/Description | Modified Date |
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Ultra low capacitance bidirectional fivefold ESD protection arrays (REV 1.0) PDF (83.0 kB) PESD5V0U5BF_PESD5V0U5BV | 15 Aug 2008 |
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plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666 | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115 | 29 Nov 2012 |
Name/Description | Modified Date |
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PESD5V0U5BV NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0U5BV | 31 Jan 2015 |
PESD5V0U5BV NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0U5BV_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
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PESD5V0U5BV | Active | SOT666 | SOT666 | 1.6 x 1.2 x 0.55 | 5 | Bidirectional | 2.9 | 3.5 | 5 | 10 | 0.1 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PESD5V0U5BV | SOT666 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PESD5V0U5BV,115 (9340 619 54115) | G7 | PESD5V0U5BV | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |