PESD5V0X1BCAL: Extremely low capacitance bidirectional ESD protection diode
Extremely low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a leadless ultra small SOD882 Surface-Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients. The combination of extremely low capacitance, high ESD maximum rating and ultra small package makes the device ideal for high-speed data line protection.
sod882_3d
Extremely low capacitance:
Cd = 0.85 pF
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Extremely low capacitance bidirectional ESD protection diode (REV 1.0) PDF (421.0 kB) PESD5V0X1BCAL | 02 Feb 2012 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD5V0X1BCAL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0X1BCAL_1 | 31 Jan 2015 |
| PESD5V0X1BCAL NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0X1BCAL_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PESD5V0X1BCAL SPICE model (REV 1.0) TXT PESD5V0X1BCAL_1_2 1/22/2014
Ordering Information
| Product | Status | Application | Package version | Package name | Size (mm) | HighSpeed D+/- | No of protected lines | CC, SBU | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) | IPPM @8/20µs [max] (A) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0X1BCAL | Active | ESD protection | SOD882 | DFN1006-2 | 1.0 x 0.6 x 0.5 | yes | 1 | yes | Bidirectional | 0.85 | 1.15 | 5 | 15 | 0.01 | 1.8 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0X1BCAL | | SOD882 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD5V0X1BCAL,315 (9340 663 11315) | NN | PESD5V0X1BCAL |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- PESD5V0X1BCAL NXP® Product Reliability pesd5v0x1bcal
- PESD5V0X1BCAL NXP® Product Quality pesd5v0x1bcal
- PESD5V0X1BCAL SPICE model PESD5V0X1BCAL
- DFN1006-2: leadless ultra small plastic package; 2 terminals pesd9x7.0l
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 315 pesd9x7.0l
- 1PS10SB82
