PESD5V0X1BCL: Extremely low capacitance bidirectional ESD protection diode
Extremely low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a leadless ultra small SOD882 (DFN1006-2) Surface-Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients. The combination of extremely low capacitance, high ESD maximum rating and ultra small package makes the device ideal for high-speed data line protection.
sod882_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Extremely low capacitance bidirectional ESD protection diode (REV 1.0) PDF (395.0 kB) PESD5V0X1BCL [English] | 13 Mar 2012 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 [English] | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD5V0X1BCL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0X1BCL_1 [English] | 31 Jan 2015 |
| PESD5V0X1BCL NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0X1BCL_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- PESD5V0X1BCL SPICE model (REV 1.0) TXT PESD5V0X1BCL_1_2 5/10/2016
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0X1BCL | Active | SOD882 | DFN1006-2 | 1.0 x 0.6 x 0.5 | 1 | Bidirectional | 0.49 | 0.6 | 5.5 | 8 | 0.01 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0X1BCL | | SOD882 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD5V0X1BCL,315 (9340 663 09315) | 11 | PESD5V0X1BCL |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- PESD5V0X1BCL NXP® Product Reliability PESD5V0X1BCL
- PESD5V0X1BCL NXP® Product Quality PESD5V0X1BCL
- PESD5V0X1BCL SPICE model PESD5V0X1BCL
- DFN1006-2: leadless ultra small plastic package; 2 terminals pesd9x7.0l
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 315 pesd9x7.0l
- 1PS10SB82
