PESD5V0X1BL: Ultra low capacitance bidirectional ESD protection diode
Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a SOD882 leadless ultra small Surface-Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients.
PESD5V0X1BL: Product Block Diagram
PESD5V0X1BL: Block Diagram
sod882_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Ultra low capacitance bidirectional ESD protection diode (REV 2.0) PDF (70.0 kB) PESD5V0X1BL | 20 Jul 2009 |
Application Notes (2)
| Name/Description | Modified Date |
|---|---|
| ESD protection for USB 2.0 interfaces (REV 3.0) PDF (264.0 kB) AN10753 | 07 Feb 2013 |
| Protecting charger interfaces and typical battery charging topologies with external bypass transistors (REV 2.0) PDF (204.0 kB) AN10910 | 01 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD5V0X1BL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0X1BL_1 | 31 Jan 2015 |
| PESD5V0X1BL NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0X1BL_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PESD5V0X1BL SPICE model (REV 1.0) TXT PESD5V0X1BL_1_2 1/22/2014
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0X1BL | Active | SOD882 | DFN1006-2 | 1.0 x 0.6 x 0.5 | 1 | Bidirectional | 0.9 | 1.3 | 5 | 9 | 0.1 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0X1BL | | SOD882 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD5V0X1BL,315 (9340 616 49315) | XX | PESD5V0X1BL |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- ESD protection for USB 2.0 interfaces prtr5v0u2x
- Protecting charger interfaces and typical battery charging topologies with external bypass transistors prtr5v0u2f
- PESD5V0X1BL NXP® Product Reliability pesd5v0x1bl
- PESD5V0X1BL NXP® Product Quality pesd5v0x1bl
- PESD5V0X1BL SPICE model PESD5V0X1BL
- DFN1006-2: leadless ultra small plastic package; 2 terminals pesd9x7.0l
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 315 pesd9x7.0l
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