PESD5V0X2UAMB: Ultra low capacitance unidirectional double ESD protection diode
Ultra low capacitance unidirectional double ElectroStatic Discharge (ESD) protection diode in a DFN1006B-3 (SOT883B) leadless ultra small Surface-Mounted Device (SMD) plastic package designed to protect up to two signal lines from the damage caused by ESD and other transients.
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Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Ultra low capacitance unidirectional double ESD protection diode (REV 1.0) PDF (204.0 kB) PESD5V0X2UAMB [English] | 10 Apr 2014 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_315 [English] | 22 Jul 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PESD5V0X2UAMB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PESD5V0X2UAMB_1 [English] | 31 Jan 2015 |
| PESD5V0X2UAMB NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0X2UAMB_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- PESD5V0X2UAMB SPICE model (REV 1.0) TXT PESD5V0X2UAMB_1_2 3/5/2014
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) | Recommended for |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0X2UAMB | Active | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | 2 | Unidirectional | 0.8 | 0.95 | 5 | 8 | 0.01 | USB2.0 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0X2UAMB | | SOT883B | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD5V0X2UAMBYL (9340 681 84315) | 0100 1111 | PESD5V0X2UAMB |    | Always Pb-free | 244.0 | 1.13 | 8.85E8 | 1 | 1 |
- Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... BC857BMB
- PESD5V0X2UAMB NXP® Product Reliability PESD5V0X2UAMB
- PESD5V0X2UAMB NXP® Product Quality PESD5V0X2UAMB
- PESD5V0X2UAMB SPICE model PESD5V0X2UAMB
- DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm BC857BMB
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- PMZB950UPE
