Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
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30 V, 0.2 A low V_F MEGA Schottky barrier rectifier (REV 1.0) PDF (793.0 kB) PMEG3002AELD | 20 Apr 2011 |
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Leadless Schottky diodes in a DC-to-DC step-up converter (REV 1.1) PDF (562.0 kB) AN11470 | 06 Mar 2015 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
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DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D | 08 Feb 2016 |
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PMEG3002AELD NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3002AELD_1 | 31 Jan 2015 |
PMEG3002AELD NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3002AELD_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) | Remark |
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PMEG3002AELD | Active | SOD882D | DFN1006D-2 | 1 x 0.6 x 0.4 | 0.2 | 30 | single | 0,01@VR=10V | 3 | 25@VR=1V | 480@IF=0,2A | solderable side pads |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PMEG3002AELD | SOD882D | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PMEG3002AELD,315 (9340 653 37315) | 1101 0000 | PMEG3002AELD | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |