Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOT23 small Surface Mounted Device (SMD) plastic package.
Name/Description | Modified Date |
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0.5 A very low VF MEGA Schottky barrier rectifiers in SOT23 package (REV 2.0) PDF (124.0 kB) PMEGXX05ET_SER | 04 Feb 2010 |
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Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
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plastic surface-mounted package; 3 leads (REV 1.0) PDF (213.0 kB) SOT23 | 08 Feb 2016 |
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Tape reel SMD; standard product orientation 12NC ending 215 (REV 1.0) PDF (202.0 kB) SOT23_215 | 16 Nov 2012 |
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PMEG4005ET NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG4005ET | 31 Jan 2015 |
PMEG4005ET NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG4005ET_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
---|---|---|---|---|---|---|---|---|---|---|---|
PMEG4005ET | Active | SOT23 | TO-236AB | 2.9 x 1.3 x 1 | 0.5 | 40 | single | 0,1@VR=40V | 10 | 50@VR=1V | 470@IF=0,5A |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
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PMEG4005ET | SOT23 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4 | Active | PMEG4005ET,215 (9340 594 28215) | P5% | PMEG4005ET | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |