PMEG4020EPA: 2 A low V_F MEGA Schottky barrier rectifier
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection. PMEG4020EPA is encapsulated in an ultra thin SOT1061 leadless small Surface−Mounted Device (SMD) plastic package with medium power capability.
Outline 3d SOT1061
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 2 A low V_F MEGA Schottky barrier rectifier (REV 1.0) PDF (153.0 kB) PMEG4020EPA | 24 Dec 2009 |
Application Notes (1)
| Name/Description | Modified Date |
|---|---|
| Leadless Schottky diodes in a DC-to-DC step-up converter (REV 1.1) PDF (562.0 kB) AN11470 | 06 Mar 2015 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| 1 and 2 A Schottky rectifiers in leadless medium-power package; NXP® low VF (MEGA) Schottky rectifier... (REV 1.0) PDF (2.6 MB) 75017425 | 20 Apr 2013 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PMEG4020EPA NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG4020EPA_1 | 31 Jan 2015 |
| PMEG4020EPA NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG4020EPA_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PMEG4020EPA SPICE model (REV 1.5) TXT PMEG4020EPA_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG4020EPA | Active | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | 2 | 40 | single | 0,1@VR=40V | 18 | 100@VR=10V | 535@IF=2A |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG4020EPA | | SOT1061 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG4020EPA,115 (9340 634 86115) | A3 | PMEG4020EPA |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
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- PMEG4020EPA NXP® Product Reliability PMEG4020EPA
- PMEG4020EPA NXP® Product Quality PMEG4020EPA
- PMEG4020EPA SPICE model PMEG4020EPA
- DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
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