PMN30XPEA: 20V, P-channel Trench MOSFET
P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
SOT457
Application Notes (2)
| Name/Description | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 | 13 Jul 2016 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 | 19 May 2014 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 | 30 Nov 2012 |
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 | 30 Nov 2012 |
Supporting Information (4)
| Name/Description | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008 | 31 Oct 2016 |
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 | 03 Jun 2013 |
Ordering Information
| Product | Status | Package version | Package name | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] (nC) | RDSon [typ] @ VGS = 4.5 V (mΩ) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | RDSon [typ] @ VGS = 2.5 V (mΩ) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | ID [max] @ T = 100 °C (A) | Automotive qualified | IDM [max] (A) | Ciss [typ] (pF) | Coss [typ] (pF) | Date | Rth(j-mb) [max] (K/W) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMN30XPEA | Introduction Pending | SOT457 | TSOP6 | P | 1 | -20 | 34 | 57 | -5.3 | 2.5 | 11 | 28 | 11 | 42 | 0.55 | -1 | -3.4 | Y | -21 | 1465 | 193 | 2016-03-02 | 1465 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMN30XPEA | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Development | PMN30XPEAX (9340 696 61115) | J7 |    | Always Pb-free | 1 | 1 |
- Using power MOSFETs in parallel BUK7M12-60E
- Using RC Thermal Models BUK7M12-60E
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- Power MOSFET frequently asked questions and answers BUK7M12-60E
- MAR_SOT457 Topmark 74LVC2G17_Q100
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
- SSL5021_SSL5031
