PMT200EPEA: 70 V, P-channel Trench MOSFET _ BDTIC a Leading Distributor in China

PMT200EPEA: 70 V, P-channel Trench MOSFET

P-channel enhancement mode Field-Effect Transistor (FET) in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

SOT223

Data Sheets (1)

Name/Description	Modified Date
70 V, P-channel Trench MOSFET (REV 2.0) PDF (344.0 kB) PMT200EPEA	26 Oct 2016

Application Notes (6)

Name/Description	Modified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599	13 Jul 2016
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH	22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261	19 May 2014
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH	14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113	16 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874	27 Jan 2011

Selector Guides (1)

Name/Description	Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631	17 Feb 2016

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223	08 Feb 2016

Packing (1)

Name/Description	Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115	07 Nov 2012

Supporting Information (3)

Name/Description	Modified Date
Power MOSFET frequently asked questions and answers (REV 2.0) PDF (1.6 MB) TN00008	31 Oct 2016
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE	30 Sep 2013

Ordering Information

Product	Status	Package version	Package name	Channel type	Number of transistors	V_DS [max] (V)	R_DSon [max] @ V_GS = 10 V (mΩ)	R_DSon [max] @ V_GS = 5 V (mΩ)	R_DSon [max] @ V_GS = 4.5 V (mΩ)	R_DSon [max] @ V_GS = 2.5 V (mΩ)	I_D [max] (A)	R_DSon [typ] @ V_GS = 10 V (mΩ)	Q_GD [typ] (nC)	R_DSon [typ] @ V_GS = 4.5 V (mΩ)	QG(tot) [typ] @ VGS = 4.5 V (nC)	QG(tot) [typ] @ VGS = 10 V (nC)	P_tot [max] (W)	Q_r [typ] (nC)	V_GSth [typ] (V)	I_D [max] @ T = 100 °C (A)	Automotive qualified	I_DM [max] (A)	C_iss [typ] (pF)	C_oss [typ] (pF)	Date	R_th(j-mb) [max] (K/W)
PMT200EPEA	Active	SOT223	SC-73	P	1	-70	167		225		-2.4	130	1.05	150		10.6	0.8	10.6	-2	-1.5	Y	-9.7	822	47	2016-07-07	822

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	MSL	MSL LF
PMT200EPEA		SOT223	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 7" Q1/T1	Active	PMT200EPEAX (9340 687 01115)	T2EPEA	PMT200EPEA		Always Pb-free	1	1

70 V, P-channel Trench MOSFET pmt200epea

Using power MOSFETs in parallel BUK7M12-60E

LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E

Using RC Thermal Models BUK7M12-60E

LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E

LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E

LFPAK MOSFET thermal design guide BUK7M12-60E

Discretes Semiconductors Selection Guide 2016 BUK7M12-60E

Power MOSFET frequently asked questions and answers BUK7M12-60E

plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A

BLT81

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