NPN/PNP resistor-equipped transistors.
Name/Description | Modified Date |
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NPN/PNP resistor-equipped transistors; R1 = 22 kOhm, R2 = open (REV 1.0) PDF (64.0 kB) PEMD19_PUMD19 | 17 Feb 2005 |
Name/Description | Modified Date |
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plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 | 08 Feb 2016 |
Name/Description | Modified Date |
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TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 | 15 Nov 2012 |
Name/Description | Modified Date |
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PUMD19 NXP® Product Quality (REV 1.1) PDF (74.0 kB) PUMD19_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
PUMD19 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PUMD19_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Name/Description | Modified Date |
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Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 | 03 Jun 2013 |
Product | Status | Package version | Package name | Size (mm) | channel type | Ptot (mW) | R2 (typ) (kΩ) | IC [max] (mA) | R1 (typ) (kΩ) | VCEO (V) |
---|---|---|---|---|---|---|---|---|---|---|
PUMD19 | Active | SOT363 | TSSOP6 | 2 x 1.25 x 0.95 | NPN/PNP | 300 | 100 | 22 | 50 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PUMD19 | ![]() | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | PUMD19,115 (9340 589 04115) | T4% | PUMD19 | ![]() ![]() ![]() | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |