PUMD30: NPN/PNP double resistor-equipped transistors; R1 = 2.2 kOhm, R2 = open

NPN/PNP double Resistor-Equipped Transistors (RET) in Surface-Mounted Device (SMD) plastic packages.

PUMD30: Product Block Diagram
SOT363
Data Sheets (1)
Name/DescriptionModified Date
NPN/PNP double resistor-equipped transistors; R1 = 2.2 kOhm, R2 = open (REV 1.0) PDF (77.0 kB) PEMD30_PUMD3031 Mar 2006
Package Information (1)
Name/DescriptionModified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_108 Feb 2016
Packing (1)
Name/DescriptionModified Date
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_11515 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
PUMD30 NXP® Product Quality (REV 1.1) PDF (74.0 kB) PUMD30_NXP_PRODUCT_QUALITY31 Jan 2015
PUMD30 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PUMD30_NXP_PRODUCT_RELIABILITY31 Jan 2015
Supporting Information (3)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE30 Sep 2013
MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT36303 Jun 2013
Design Support
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)channel typePtot (mW)R2 (typ) (kΩ)IC [max] (mA)R1 (typ) (kΩ)VCEO (V)
PUMD30ActiveSOT363TSSOP62 x 1.25 x 0.95NPN/PNP3001002.250
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PUMD30SOT363Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActivePUMD30,115 (9340 599 34115)Standard MarkingPUMD30Always Pb-free153.00.711.41E911