PUSB2X4D: ESD protection for high-speed interfaces
The device is designed to protect high-speed interfaces such as USB 2.0 ports against ElectroStatic Discharge (ESD).
The device includes four high-level ESD protection diode structures for high-speed signal lines. It is encapsulated in a small SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package.
All signal lines are protected by a special diode configuration offering ultra low line capacitance of 0.85 pF maximum. This configuration provides protection to downstream components from ESD voltages up to ±12 kV contact according to IEC 61000-4-2, level 4.
SOT457
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| ESD protection for high-speed interfaces (REV 1.0) PDF (507.0 kB) PUSB2X4D [English] | 05 Nov 2013 |
Brochures (1)
| Name/Description | Modified Date |
|---|---|
| Application guide: ESD protection (REV 1.0) PDF (11.5 MB) 75017664 [English] | 03 Jul 2015 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English] | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English] | 30 Nov 2012 |
Reliability and Quality Information (1)
| Name/Description | Modified Date |
|---|---|
| PUSB2X4D NXP® Product Quality (REV 1.1) PDF (74.0 kB) PUSB2X4D_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English] | 03 Jun 2013 |
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) | Recommended for |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PUSB2X4D | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | 4 | Rail-to-Rail | 0.6 | 0.75 | 5.5 | 12 | 1 | USB2.0 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PUSB2X4D | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | PUSB2X4DH (9340 680 76125) | DE | PUSB2X4D |    | Always Pb-free | 1 | 1 |
- Application guide: ESD protection prtr5v0u2x
- PUSB2X4D NXP® Product Quality PUSB2X4D
- MAR_SOT457 Topmark 74LVC2G17_Q100
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- SSL5021_SSL5031
