PUSB3AB4: ESD protection for ultra high-speed interfaces

The device is designed to protect high-speed interfaces such as SuperSpeed USB 3.1 at 10 Gbps, High-Definition Multimedia Interface (HDMI), DisplayPort, external Serial Advanced Technology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS) interfaces against ElectroStatic Discharge (ESD).

The device includes a high-level ESD protection diode structure protecting sensitive transmitters and receivers for ultra high-speed signal lines. The device is encapsulated in a leadless small DFN2510A-10 (SOT1176-1) plastic package.

All signal lines are protected by a special diode configuration offering ultra low line capacitance of only 0.2 pF maximum. These diodes utilize a snapback structure in order to provide protection to downstream components from ESD voltages up to ±15 kV contact exceeding IEC 61000-4-2, level 4.

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The device is designed for high-speed receiver and transmitter port protection:

  • Smartphones, tablet computers, Mobile Internet Devices (MID) and portable devices
  • TVs and monitors
  • DVD recorders and players
  • Notebooks, main board graphic cards and ports
  • Set-top boxes and game consoles
Data Sheets (1)
Name/DescriptionModified Date
ESD protection for ultra high-speed interfaces (REV 2.0) PDF (1.1 MB) PUSB3AB4 [English]04 May 2016
Brochures (2)
Name/DescriptionModified Date
Application guide for USB 3.1 (REV 1.0) PDF (7.5 MB) APPLICATION_GUIDE_FOR_USB_3_1 [English]24 Jul 2015
Application guide: ESD protection (REV 1.0) PDF (11.5 MB) 75017664 [English]03 Jul 2015
Package Information (1)
Name/DescriptionModified Date
DFN2510A-10: plastic extremely thin small outline package; no leads; 10 terminals (REV 1.0) PDF (206.0 kB) SOT1176-1 [English]08 Feb 2016
Packing (1)
Name/DescriptionModified Date
DFN2510A-10; Reel pack, SMD 7" Q1/T1 standard product orientation; Orderable part number ending ,115 or X, Ordering code... (REV 1.0) PDF (202.0 kB) SOT1176-1_115 [English]16 Dec 2014
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)Recommended for
PUSB3AB4ActiveSOT1176-1DFN2510A-102.5 x 1 x 0.54Bidirectional0.170.25150.1
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateMSLMSL LF
PUSB3AB4SOT1176-1Reflow_Soldering_ProfileReel 7" Q1/T1 in Sulfur Barrier BagActivePUSB3AB4Z (9340 692 01471)Standard MarkingPUSB3AB4Always Pb-free12
Reel 7" Q1/T1WithdrawnPUSB3AB4X (9340 692 01115)Standard MarkingPUSB3AB4Always Pb-free11
ESD protection for ultra high-speed interfaces PUSB3AB4
Application guide for USB 3.1 PUSB3FR6
Application guide: ESD protection prtr5v0u2x
PUSB3AB4 SPICE Model PUSB3AB4
SOT1176-1 ip4283cz10_series
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reel 7" Q1/T1 ip4283cz10_series
PUSB3FR4