RB520S30: 200 mA low VF MEGA Schottky barrier rectifier
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD523 (SC-79) ultra small and flat lead Surface-Mounted Device (SMD) plastic package.
Simplified outline: SOD523 (SC-79)
RB520S30: Block Diagram
sod523_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 200 mA low Vf MEGA Schottky barrier rectifier (REV 1.0) PDF (244.0 kB) RB520S30 | 08 Oct 2009 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (174.0 kB) SOD523 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (179.0 kB) SOD523_115 | 07 Nov 2012 |
| Tape reel; standard product orientation 12NC ending 315 (REV 1.0) PDF (179.0 kB) SOD523_315 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| RB520S30 NXP Product Quality (REV 1.2) PDF (74.0 kB) RB520S30_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
| RB520S30 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) RB520S30_NXP_PRODUCT_RELIABILITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- RB520S30 SPICE model (REV 1.4) prm RB520S30_1 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | IR [max] (µA) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | VR [max] (V) | IF [max] (mA) | VR (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| RB520S30 | Active | SOD523 | SOD523 | 1.2 x 0.8 x 0.6 | 1@VR=10V | single | 600@IF=200mA | 1 | 20@VR=1V | 30 | 200 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| RB520S30 | | SOD523 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | RB520S30YL (9340 639 54315) | ZA | RB520S30 |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | RB520S30,115 (9340 639 54115) | ZA | RB520S30 | | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- RB520S30 NXP Product Quality RB520S30
- RB520S30 NXP® Product Reliability RB520S30
- RB520S30 SPICE model RB520S30
- plastic surface-mounted package; 2 leads pesd5z7.0
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel; standard product orientation 12NC ending 315 pesd5v0u1bb
- Tape reel; standard product orientation 12NC ending 115 pesd5z7.0
- 1PSXSB17
- BB208-02
