SAF1761BE: Hi-Speed Universal Serial Bus On-The-Go controller
The SAF1761 is a single-chip Hi-Speed Universal Serial Bus (USB) On-The-Go (OTG) Controller integrated with advanced NXP® slave host controller and the peripheral controller.
The Hi-Speed USB host controller and peripheral controller comply to Universal Serial Bus Specification Rev. 2.0 and support data transfer speeds of up to 480 Mbit/s. The Enhanced Host Controller Interface (EHCI) core implemented in the host controller is adapted from Enhanced Host Controller Interface Specification for Universal Serial Bus Rev. 1.0. The OTG controller adheres to On-The-Go Supplement to the USB Specification Rev. 1.3.
The SAF1761 has three USB ports. Port 1 can be configured to function as a downstream port, an upstream port or an OTG port; ports 2 and 3 are always configured as downstream ports. The OTG port can switch its role from host to peripheral, and peripheral to host. The OTG port can become a host through the Host Negotiation Protocol (HNP) as specified in the OTG supplement.
sot425-1_3d
The SAF1761 can be used to implement a dual-role USB device, USB host or USB peripheral, depending on the cable connection. If the dual-role device is connected to a typical USB peripheral, it behaves like a typical USB host. The dual-role device can also be connected to a PC or any other USB host and behave like a typical USB peripheral.
This NXP USB product can only be used in automotive applications. Inclusion or use of the NXP USB products in other than automotive applications is not permitted and for your company’s own risk. Your company agrees to full indemnify NXP for any damages resulting from such inclusion or use.
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| Hi-Speed Universal Serial Bus On-The-Go controller (REV 2.0) PDF (1.3 MB) SAF1761 | 16 Nov 2012 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm (REV 1.0) PDF (719.0 kB) SOT425-1 | 08 Feb 2016 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Footprint for wave soldering (REV 1.0) PDF (11.0 kB) HTQFP-HLQFP-LQFP-MSQFP-WAVE | 08 Oct 2009 |
Ordering Information
| Product | Status | Package version | Package name |
|---|---|---|---|
| SAF1761BE/V1 | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SAF1761BE/V1 | | SOT425-1 | HTQFP-HLQFP-LQFP-MSQFP-WAVE | Tray, Bakeable, Multiple in Drypack | Active | SAF1761BE/V1,557 (9352 879 56557) | Standard Marking | SAF1761BE/V1 |    | Always Pb-free | 3 | 3 |
| Reel 13" Q1/T1 in Drypack | Active | SAF1761BE/V1,518 (9352 879 56518) | Standard Marking | SAF1761BE/V1 | | Always Pb-free | 3 | 3 |
- plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm SAF1761BE
- Footprint for reflow soldering SOT425-1 SAF1761BE
- HTQFP-HLQFP-LQFP-MSQFP-WAVE LPC54114J256BD64
