UJA1065TW: High-speed CAN/LIN fail-safe system basis chip

The UJA1065 fail-safe System Basis Chip (SBC) replaces basic discrete components that are common in every Electronic Control Unit (ECU) with a Controller Area Network (CAN) and a Local Interconnect Network (LIN) interface. The fail-safe SBC supports all networking applications that control various power and sensor peripherals by using high-speed CAN as the main network interface and LIN as a local sub-bus. The fail-safe SBC contains the following integrated devices:

In addition to the advantages of integrating these common ECU functions in a single package, the fail-safe SBC offers an intelligent combination of system-specific functions such as:

The UJA1065 is designed to be used in combination with a microcontroller that incorporates a CAN controller. The fail-safe SBC ensures that the microcontroller is always started up in a defined manner. In failure situations, the fail-safe SBC will maintain microcontroller functionality for as long as possible to provide full monitoring and a software-driven fall-back operation.

The UJA1065 is designed for 14 V single power supply architectures and for 14 V and 42 V dual power supply architectures.

UJA1065TW: Product Block Diagram
sot549-1_3d
2.1 General
  • Contains a full set of CAN and LIN ECU functions: CAN transceiver and LIN transceiver Voltage regulator for the microcontroller (3.3 V or 5.0 V) Separate voltage regulator for the CAN transceiver (5 V) Enhanced window watchdog with on-chip oscillator Serial Peripheral Interface (SPI) for the microcontroller ECU power management system Fully integrated autonomous fail-safe system
  • Designed for automotive applications: Supports 14 V and 42 V architectures Excellent ElectroMagnetic Compatibility (EMC) performance ±8 kV ElectroStatic Discharge (ESD) protection Human Body Model (HBM) for off-board pins ±4 kV ElectroStatic Discharge (ESD) protection IEC 61000-4-2 for off-board pins ±60 V short-circuit proof CAN/LIN-bus pins Battery and CAN/LIN-bus pins are protected against transients in accordance with ISO 7637-3 Very low sleep current
  • Supports remote flash programming via the CAN-bus
  • Small 6.1 mm × 11 mm HTSSOP32 package with low thermal resistance
2.2 CAN transceiver
  • ISO 11898-2 and ISO 11898-5 compliant high-speed CAN transceiver
  • Enhanced error signalling and reporting
  • Dedicated low dropout voltage regulator for the CAN-bus: Independent from microcontroller supply Guarded by CAN-bus failure management Significantly improves EMC performance
  • Partial networking option with global wake-up feature, allows selective CAN-bus communication without waking up sleeping nodes
  • Bus connections are truly floating when power is off
  • SPLIT output pin for stabilizing the recessive bus level
2.3 LIN transceiver
  • LIN 2.0 compliant LIN transceiver
  • Enhanced error signalling and reporting
  • Downward compatible with LIN 1.3 and the TJA1020
2.4 Power management
  • Smart operating modes and power management modes
  • Cyclic wake-up capability in Standby and Sleep mode
  • Local wake-up input with cyclic supply feature
  • Remote wake-up capability via the CAN-bus and LIN-bus
  • External voltage regulators can easily be incorporated in the power supply system (flexible and fail-safe)
  • 42 V battery-related high-side switch for driving external loads such as relays and wake-up switches
  • Intelligent maskable interrupt output
2.5 Fail-safe features
  • Safe and predictable behavior under all conditions
  • Programmable fail-safe coded window and time-out watchdog with on-chip oscillator, guaranteeing autonomous fail-safe system supervision
  • Fail-safe coded 16-bit SPI interface for the microcontroller
  • Global enable pin for the control of safety-critical hardware
  • Detection and detailed reporting of failures: On-chip oscillator failure and watchdog alerts Battery and voltage regulator undervoltages CAN and LIN-bus failures (short-circuits and open-circuit bus wires) TXD and RXD clamping situations and short-circuits Clamped or open reset line SPI message errors Overtemperature warning ECU ground shift (two selectable thresholds)
  • Rigorous error handling based on diagnostics
  • Supply failure early warning allows critical data to be stored
  • 23 bits of access-protected RAM is available e.g. for logging of cyclic problems
  • Reporting in a single SPI message; no assembly of multiple SPI frames needed
  • Limp-home output signal for activating application hardware in case system enters Fail-safe mode (e.g. for switching on warning lights)
  • Fail-safe coded activation of Software development mode and Flash mode
  • Unique SPI readable device type identification
  • Software-initiated system reset
Data Sheets (1)
Name/DescriptionModified Date
High-speed CAN/LIN fail-safe system basis chip (REV 7.0) PDF (457.0 kB) UJA106525 Feb 2010
Package Information (1)
Name/DescriptionModified Date
plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die... (REV 1.0) PDF (380.0 kB) SOT549-108 Feb 2016
Ordering Information
ProductStatusProduct categoryCategorySupported standardsPackage nameLow power modesSupply voltage [min] (V)Package versionSupply voltage [max] (V)Data rate [min] (kb/s)Data rate [max] (kb/s)CAN channelsLIN channelsVoltage on bus pins [min] (V)Voltage on bus pins [max] (V)FlexRay ChannelsVESD IEC61000-4-2 (kV)VESD HBM on bus pins (+/- kV)VIO option availableApplicationRecommended VersionTvj [max] (°C)SPLIT pinUnder-voltage detectionTX Dominant Time outOver-temperature detectionINH / Wake PinMin High Input Levels (V)No of pins
UJA1065TW/3V3/C/TActiveSBC; High-Speed CAN; LIN Transceiver; Fail-safe SBCISO-11898-2; ISO-11898-5; LIN-2.0; SAE-J2602HTSSOP32Standby Mode; Sleep Mode5.53318100011-606048NoYes150mA
UJA1065TW/5V0/C/TActiveSBC; High-Speed CAN; LIN Transceiver; Fail-safe SBCISO-11898-2; ISO-11898-5; LIN-2.0; SAE-J2602HTSSOP32Standby Mode; Sleep Mode5.53318100011-606048NoYes150mA
UJA1065TW/5V0No Longer ManufacturedSBC; High-Speed CAN; LIN Transceiver; Fail-safe SBCISO-11898-2; ISO-11898-5; LIN-2.0; SAE-J2602HTSSOP32Standby Mode; Sleep Mode5.53318100011-606048NoYes150mA
UJA1065TW/5V0/CNo Longer ManufacturedSBC; High-Speed CAN; LIN Transceiver; Fail-safe SBCISO-11898-2; ISO-11898-5; LIN-2.0; SAE-J2602HTSSOP32Standby Mode; Sleep Mode5.53318100011-606048NoYes150mA
UJA1065TW/3V0/CNo Longer ManufacturedSBC; High-Speed CAN; LIN Transceiver; Fail-safe SBCISO-11898-2; ISO-11898-5; LIN-2.0; SAE-J2602HTSSOP32Standby Mode; Sleep Mode5.53318100011-606048NoYes150mA
UJA1065TW/3V3/CNo Longer ManufacturedSBC; High-Speed CAN; LIN Transceiver; Fail-safe SBCISO-11898-2; ISO-11898-5; LIN-2.0; SAE-J2602HTSSOP32Standby Mode; Sleep Mode5.53318100011-606048NoYes150mA
UJA1065TW/3V0No Longer ManufacturedSBC; High-Speed CAN; LIN Transceiver; Fail-safe SBCISO-11898-2; ISO-11898-5; LIN-2.0; SAE-J2602HTSSOP32Standby Mode; Sleep Mode5.53318100011-606048NoYes150mA
UJA1065TWNo Longer ManufacturedSBC; High-Speed CAN; LIN Transceiver; Fail-safe SBCSBCISO-11898-2; ISO-11898-5; LIN-2.0; SAE-J2602HTSSOP32Standby Mode; Sleep Mode5.5SOT549-13318100011-6060048NoYes150mA-40~150YesYesYesYesYes0.7 x Vv132
UJA1065TW/3V3No Longer ManufacturedSBC; High-Speed CAN; LIN Transceiver; Fail-safe SBCISO-11898-2; ISO-11898-5; LIN-2.0; SAE-J2602HTSSOP32Standby Mode; Sleep Mode5.53318100011-606048NoYes150mA
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateMSLMSL LF
UJA1065TW/3V3/C/TSOT549-1Reel 13" Q1/T1 in DrypackActiveUJA1065TW/3V3/C/T, (9352 888 67518)Standard MarkingUJA1065TW/3V3/C/TAlways Pb-free33
Tube in DrypackActiveUJA1065TW/3V3:512 (9352 888 67512)Standard MarkingUJA1065TW/3V3/C/TAlways Pb-free33
UJA1065TW/5V0/C/TSOT549-1Reel 13" Q1/T1 in DrypackActiveUJA1065TW/5V0/C/T, (9352 888 68518)Standard MarkingUJA1065TW/5V0/C/TAlways Pb-free33
Tube in DrypackActiveUJA1065TW/5V0/512 (9352 888 68512)Standard MarkingUJA1065TW/5V0/C/TAlways Pb-free33
High-speed CAN/LIN fail-safe system basis chip uja1065tw
UJA1065TW
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Footprint for reflow soldering SOT549-1 UJA1079ATW
plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad UJA1079ATW