BCP56T-SERIES: 80 V, 1 A NPN medium power transistors
PNP medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.
Type number
Package
NPN
NXP
JEITA
JEDEC
BCP56T
SOT223
SC-73
-
BCP53T
BCP56-10T
BCP53-10T
BCP56-16T
BCP53-16T
SOT223
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 80 V, 1 A NPN medium power transistors (REV 1.0) PDF (1.2 MB) BCP56T_SER [English] | 05 Jul 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English] | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English] | 07 Nov 2012 |
Supporting Information (2)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE model
- BCP56-10T SPICE model (REV 1.0) TXT BCP56-10T 7/21/2016
- BCP56-16T SPICE model (REV 1.0) TXT BCP56-16T 7/21/2016
- BCP56T SPICE model (REV 1.0) TXT BCP56T 7/21/2016
Ordering Information
| Product | Status |
|---|---|
| BCP56-16T | Active |
| BCP56-10T | Active |
| BCP56T | Active |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP56T | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BCP56TX (9340 701 17115) | Standard Marking | BCP56T |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCP56-10T | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BCP56-10TX (9340 701 18115) | Standard Marking | BCP56-10T | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| BCP56-16T | | SOT223 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Active | BCP56-16TX (9340 701 19115) | Standard Marking | BCP56-16T | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 11¼" Q1/T1 in LargePack | Active | BCP56-16TF (9340 701 19135) | Standard Marking | BCP56-16T | 153.0 | 0.71 | 1.41E9 |
- 80 V, 1 A NPN medium power transistors BCP56T_SERIES
- BCP56-10T SPICE model BCP56T_SERIES
- BCP56-16T SPICE model BCP56T_SERIES
- BCP56T SPICE model BCP56T_SERIES
- plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
- Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
- BLT81
