Silicon Monolitic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 plastic SMD package.

| Name/Description | Modified Date |
|---|---|
| MMIC wideband amplifier (REV 2.1) PDF (302.0 kB) BGA2711 | 02 Mar 2011 |
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 6 leads (REV 1.0) PDF (246.0 kB) SOT363_1 | 08 Feb 2016 |
| Name/Description | Modified Date |
|---|---|
| TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT363_115 | 15 Nov 2012 |
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT363 Topmark (REV 1.0) PDF (104.0 kB) MAR_SOT363 | 03 Jun 2013 |
| Product | Status | Package version | @VCC (V) | @ICC (mA) | B-3dB (GHz) | NF (dB) | PL(sat) (dBm) | Gp (dB) | PL(1dB) (dBm) | IP3 (dBm) | f (MHz) | @f (MHz) | VCC lim (V) | ICC lim (mA) | Ptot lim (mW) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BGA2711 | End of Life | ||||||||||||||
| BGA2711/DB1 | No Longer Manufactured |
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BGA2711 | ![]() | SOT363 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q1/T1 | Discontinued | BGA2711,115 (9340 566 27115) | G2% | BGA2711 | ![]() ![]() ![]() | week 23, 2003 | NA | NA |