The BGS8324 is a fully integrated MMIC Low Noise Amplifier (LNA) and SP3T switch (SW) for Bluetooth path and transmit path for WLAN applications in the 2.4 GHz to 2.5 GHz ISM band. Manufactured using NXP®'s high performance QUBiC eighth generation SiGe:C technology, the BGS8324 couples best-in-class noise figure, linearity and efficiency and low insertion loss CMOS switches with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGS8324 has a 2.0 mm x 2.0 mm footprint HX2QFN12 package (Heat sink eXtremely thin, 2nd generation, Quad Flat No lead, 12 terminals) and a thickness of 300 µm.
Name/Description | Modified Date |
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WLAN LNA + Switch (REV 2.0) PDF (137.0 kB) BGS8324 | 22 Jun 2016 |
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plastic, thermal enhanced super thin quad flat package; no leads;12 terminals; body 2.0 x 2.0 x 0.3 mm (REV 1.2) PDF (212.0 kB) SOT1261-1 | 28 Jun 2016 |
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HX2QFN12; Reel pack, SMD, 7" Q2/T3 standard product orientation Orderable part number ending ,147 or... (REV 2.0) PDF (189.0 kB) SOT1261-1_147 | 28 Oct 2016 |
Product | Status | Package version | @VCC [min] (V) | @VCC [max] (V) | @ICC [typ] (mA) | Gp [typ] (dB) | NF [typ] (dB) | Pi(1dB) [min] (dBm) | Pi(1dB) [typ] (dBm) | IP3i [min] (dBm) | IP3i [typ] (dBm) | @VCC (V) | @f (MHz) |
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BGS8324 | Active | SOT1261-1 | 2.7 | 5.25 | 16 | 2 | -6.000000000000001 |
Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | MSL | MSL LF |
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BGS8324 | SOT1261-1 | Reel 7" Q2/T3 | Active | BGS8324Z (9340 689 36147) | Standard Marking | BGS8324 | Always Pb-free | 1 | 1 |