MSC8156E: High-Performance Six-Core DSP with Security
The MSC8156E is based on the industry's highest-performance DSP core built on StarCore® technology and designed for the advanced processing requirements and capabilities of today's high-performance applications for the wireless broadband, medical imaging, aerospace, defense and advanced test and measurement markets. It delivers industry-leading performance and power savings, leveraging 45 nm process technology in a highly integrated system-on-chip (SoC) to provide performance equivalent to a 6 GHz, single-core device. The MSC8156E helps equipment manufacturers create end products and services that integrate more functionality in a smaller hardware footprint.
The MSC8156E DSP delivers a high level of performance and integration, combining six fully programmable enhanced SC3850 DSP cores, each running at up to 1 GHz. Developed by NXP® and integrated on-chip, the MAPLE-B accelerator supports hardware acceleration for Turbo and Viterbi channel decoding and for DFT/iDFT and FFT/iFFT algorithms. A high-performance internal RISC-based QUICC Engine® subsystem supports multiple networking protocols to guarantee reliable data transport over packet networks while significantly offloading processing from the DSP cores.
The MSC8156E embeds large internal memory and supports a variety of advanced high-speed interface types, including two RapidIO® interfaces, two gigabit Ethernet interfaces for network communications, a PCI Express® controller, two DDR controllers for high-speed, industry standard memory interface and four multi-channel TDM interfaces. The MSC8156E allows a high degree of scalability through pin compatibility with all MSC825x and MSC815x DSP devices.
MSC8156 High-Performance Six-Core DSP Block Diagram
![MSC8156 High-Performance Six-Core DSP Block Diagram](/image/nxp/MSC8156_BD.jpg)
MSC8156 High-Performance Six-Core DSP Product Image
![MSC8156 High-Performance Six-Core DSP Product Image](/image/nxp/MSC8156_IMG.jpg)
特性
- Six StarCore® DSP SC3850 core subsystems each with:
- SC3850 DSP core at up to 1 GHz
- 512 KB unified L2 cache/M2 memory
- 32 KB I-cache, 32 KB D-cache
- Fully programmable 1056 KB M3 shared memory (SRAM)
- SC3850 DSP core at up to 1 GHz
- 512 KB unified L2 cache/M2 memory
- 32 KB I-cache, 32 KB D-cache
- Fully programmable 1056 KB M3 shared memory (SRAM)
- MAPLE-B - highly flexible programmable Turbo and Viterbi decoder supports configurable decoding parameters. It can perform up to 200 Mbps of Turbo decoding (six iterations) or up to 115 Mbps of K = 9 (zero tail) Viterbi decoding
- SEC (MSC8156E) optimized to process all the encryption/decryption algorithms associated with IPSec, IKE, WTLS/WAP, SSL/TLS, AES, DES, RC-4, SNOW-3G and Kasumi for 3G-LTE and 3GPP
- Two DDR 2/3 64-bit SDRAM interfaces at up to 800 MHz data rate
- Chip-level arbitration and switching fabric, non-blocking, fully pipelined, low latency
- High-speed interconnects:
- Dual 4x/1x Serial RapidIO® at 1.25/2.5/3.125 Gbaud
- PCI Express® 4x/1x
- Two SGMII
- Dual 4x/1x Serial RapidIO® at 1.25/2.5/3.125 Gbaud
- PCI Express® 4x/1x
- Two SGMII
- Dual RISC QUICC Engine® supporting:
- RGMII gigabit Ethernet ports
- Serial peripheral interface (SPI)
- RGMII gigabit Ethernet ports
- Serial peripheral interface (SPI)
- TDM highway 1024 ch., 400 Mbps, divided into four ports of 256
- DMA engine 16 bi-directional channels
- Other peripheral interfaces:
- UART
- I²C
- 32 GPIO
- 16 timers
- Technology
- Process: 45 nm SOI
- Voltage: 1-volt core, 2.5, 1.8/1.5-volt I/O
- Package: FC-BPGA (29x29) 1 mm pitch, RoHS
- Process: 45 nm SOI
- Voltage: 1-volt core, 2.5, 1.8/1.5-volt I/O
- Package: FC-BPGA (29x29) 1 mm pitch, RoHS
Recommended Documentation (2)
Data Sheets (1)
Application Notes (36)
Reference Manuals (5)
Users Guides (1)
Product Briefs (1)
Engineering Bulletins (2)
Fact Sheets (2)
Brochures (1)
Selector Guides (1)
Package Information (1)
Ordering Information
Product | Status | Budgetary Price excluding tax(US$) | Package Type and Termination Count | Core Type | Operating Frequency (Max) (MHz) | Core: Number of cores (Spec) | Ambient Operating Temperature (Min-Max) (°C) | Cache (KB) | L2 Cache (Max) (KB) | Internal RAM (KB) | External Memory Supported | Total DMA Channels | Ethernet Type | Additional Features |
---|
MSC8156ETVT1000B | No Longer Manufactured | | FCPBGA 783 | SC3850 | 1000 | 6 | -40 to 105 | 32 | 512 | | DDR2, DDR3 | 16 | 1GBaseT, SGMII | |
MSC8156ESVT1000B | No Longer Manufactured | | FCPBGA 783 | SC3850 | 1000 | 6 | 0 to 105 | 32 | 512 | | DDR2, DDR3 | 16 | 1GBaseT, SGMII | |
Package Information
Package Description | Outline Version | Packing | Product Status | Part Number | Chemical Content | RoHS / Pb FreeChina RoHS Lookup | MSL | PPT (°C) |
---|
FCPBGA 783 29SQ3.55P1.0 | 98ARE10738D | | No Longer Manufactured | MSC8156ESVT1000B | MSC8156ESVT1000B.pdf | ![](/image/nxp/RoHS_image_transparent.gif) | 3 | 245 |
| No Longer Manufactured | MSC8156ETVT1000B | MSC8156ETVT1000B.pdf | ![](/image/nxp/RoHS_image_transparent.gif) | 3 | 245 |