NT3H1101W0FTT: NTAG I²C - Energy harvesting NFC Forum Type 2 Tag with field detection pin and I²C interface

The NTAG I²C is the first product of NXP’s NTAG family offering both contactless and contact interfaces. In addition to the passive NFC Forum compliant contactless interface, the IC features an I²C contact interface, which can communicate with a microcontroller if the NTAG I²C is powered from an external power supply. An additional externally powered SRAM mapped into the memory allows a fast data transfer between the RF and I²C interfaces and vice versa, without the write cycle limitations of the EEPROM memory.

The NTAG I²C product features a configurable field detection pin, which provides a trigger to an external device depending on the activities at the RF interface.

The NTAG I²C product can also supply power to external (low power) devices (e.g. a microcontroller) via the embedded energy harvesting circuitry.

More information about NTAG I²C applications and use cases can be found in brochure “NFC for embedded applications”.

Block diagram
Outline 3d SOT505-1

With all its integrated features and functions the NTAG I²C is the ideal solution to enable a contactless communication via an NFC device (e.g., NFC enabled mobile phone) to an electronic device for:

  • Zero power configuration (late customization)
  • Smart customer interaction (e.g., easier after sales service, such as firmware update)
  • Advanced pairing (for e.g., WiFi or Blue tooth) for dynamic generation of sessions keys

Easier product customization and customer experience for the following applications:

  • Home automation
  • Home appliances
  • Consumer electronics
  • Healthcare
  • Printers
  • Smart meters
Data Sheets (1)
Name/DescriptionModified Date
NTAG® I²C - Energy harvesting NFC Forum Type 2 Tag with field detection pin and I²C interface (REV 3.3) PDF (1.8 MB) NT3H1101_120120 Jul 2015
Application Notes (1)
Name/DescriptionModified Date
NTAG® Antenna Design Guide (REV 1.5) ZIP (4.8 MB) AN11276_1_227 Apr 2016
Users Guides (1)
Name/DescriptionModified Date
I2C-bus specification and user manual (REV 6.0) PDF (1.4 MB) UM1020428 Apr 2014
Brochures (3)
Name/DescriptionModified Date
恩智浦 NFC标签芯片 NTAG® I²C (REV 1.0) PDF (569.0 kB) 75017479_CN09 Sep 2015
NTAG® I²C (REV 1.1) PDF (1.2 MB) 7501747927 May 2015
NFC for embedded applications: Your critical link for the Internet of Things (REV 1.0) PDF (3.6 kB) 7501758709 Sep 2014
Package Information (1)
Name/DescriptionModified Date
plastic thin shrink small outline package; 8 leads; body width 3 mm (REV 1.0) PDF (240.0 kB) SOT505-108 Feb 2016
Packing (1)
Name/DescriptionModified Date
TSSOP8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or... (REV 1.0) PDF (214.0 kB) SOT505-1_11815 Apr 2013
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
Ordering Information
ProductStatusStatusBudgetary Price excluding tax(US$)Package Type and Termination CountGPIOsQualification Tier
NT3H1101W0FTTActive
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateMSLMSL LF
NT3H1101W0FTTSOT505-1Reflow_Soldering_ProfileReel 13" Q1/T1ActiveNT3H1101W0FTTJ (9353 054 81118)Standard MarkingNT3H1101W0FTTAlways Pb-free11