PBSS2540MB: 40 V, 0.5 A NPN low VCEsat (BISS) transistor
NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. PNP complement: PBSS3540MB.
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Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 40 V, 0.5 A NPN low VCEsat (BISS) transistor (REV 1.0) PDF (465.0 kB) PBSS2540MB | 11 Apr 2012 |
Application Notes (2)
| Name/Description | Modified Date |
|---|---|
| Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors (REV 3.0) PDF (1.3 MB) AN11045 | 04 Mar 2013 |
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 | 12 Jul 2011 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B | 08 Feb 2016 |
Packing (1)
| Name/Description | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_315 | 22 Jul 2016 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSS2540MB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS2540MB_1 | 31 Jan 2015 |
| PBSS2540MB NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS2540MB_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PBSS2540MB SPICE model (REV 1.4) prm PBSS2540MB_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Transistor polarity | transistor polarity | number of transistors | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | fT [min] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS2540MB | Active | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | NPN | 1 | 250 | 40 | 0.5 | 1 | 200 | 450 | 250 | 380 | 250 | 500 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS2540MB | | SOT883B | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PBSS2540MB,315 (9340 658 76315) | 0001 0010 | PBSS2540MB |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- 40 V, 0.5 A NPN low VCEsat (BISS) transistor PBSS2540MB
- Next generation of NXP® low VCEsat transistors: improved technology for discrete semiconductors PBSS4041SPN
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- PBSS2540MB NXP® Product Reliability PBSS2540MB
- PBSS2540MB NXP Product Quality PBSS2540MB
- PBSS2540MB SPICE model PBSS2540MB
- DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm BC857BMB
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... BC857BMB
- PMZB950UPE
