PBSS302PD: 40 V, 4 A PNP low VCesat (BISS) transistor
PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package.
NPN complement: PBSS302ND.
PBSS302PD: Product Block Diagram
PBSS302PD: Block Diagram
SOT457
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 40 V, 4 A PNP low VCesat (BISS) transistor (REV 2.0) PDF (143.0 kB) PBSS302PD | 06 Dec 2007 |
Application Notes (2)
| Name/Description | Modified Date |
|---|---|
| Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 | 12 Jul 2011 |
| Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... (REV 1.0) PDF (400.0 kB) AN10405 | 06 Jan 2006 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 | 30 Nov 2012 |
| Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 | 30 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PBSS302PD NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS302PD_1 | 31 Jan 2015 |
| PBSS302PD NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS302PD_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (3)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
| Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE | 30 Sep 2013 |
| MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 | 03 Jun 2013 |
SPICE model
- PBSS302PD SPICE model (REV 1.4) prm PBSS302PD_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | Transistor polarity | transistor polarity | Ptot [max] (mW) | number of transistors | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [typ] (MHz) | RCEsat [typ] (mΩ) | VCEsat [max] (mV) | RCEsat [max] (mΩ) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS302PD | Active | SOT457 | TSOP6 | 2.9 x 1.5 x 1 | PNP | 360 | 1 | -40 | -4 | -15 | 200 | 110 | 55 | -60 | 75 |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PBSS302PD | | SOT457 | Reflow_Soldering_Profile
Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile | Reel 7" Q3/T4, Reverse | Active | PBSS302PDH (9340 591 32125) | C9 | PBSS302PD |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
| Reel 7" Q1/T1 | Active | PBSS302PD,115 (9340 591 32115) | C9 | PBSS302PD | | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
- Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat... BCX56-16
- PBSS302PD NXP® Product Reliability PBSS302PD
- PBSS302PD NXP Product Quality PBSS302PD
- MAR_SOT457 Topmark 74LVC2G17_Q100
- PBSS302PD SPICE model PBSS302PD
- plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
- TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
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