PBSS303PZ: 30 V, 5.3 A PNP low VCEsat (BISS) transistor

PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT223 (SC-73) small Surface-Mounted Device (SMD) plastic package.

NPN complement: PBSS303NZ.

PBSS303PZ: Product Block Diagram
PBSS303PZ: Block Diagram
SOT223
Data Sheets (1)
Name/DescriptionModified Date
30 V, 5.3 A PNP low VCEsat (BISS) transistor (REV 2.0) PDF (164.0 kB) PBSS303PZ10 Dec 2009
Application Notes (1)
Name/DescriptionModified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN1107612 Jul 2011
Package Information (1)
Name/DescriptionModified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT22308 Feb 2016
Packing (1)
Name/DescriptionModified Date
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_13507 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
PBSS303PZ NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS303PZ_131 Jan 2015
PBSS303PZ NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS303PZ_NXP_PRODUCT_QUALITY31 Jan 2015
Supporting Information (2)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)Transistor polaritytransistor polarityPtot [max] (mW)number of transistorsVCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)RCEsat [max] (mΩ)
PBSS303PZActiveSOT223SC-736.5 x 3.5 x 1.65PNP7001-30-5.3-10.62504001300.0360.061-3553
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
PBSS303PZSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActivePBSS303PZ,135 (9340 590 51135)S303PZPBSS303PZAlways Pb-free153.00.711.41E911
30 V, 5.3 A PNP low VCEsat (BISS) transistor PBSS303PZ
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBSS303PZ NXP® Product Reliability PBSS303PZ
PBSS303PZ NXP Product Quality PBSS303PZ
PBSS303PZ SPICE model PBSS303PZ
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
PBHV9115Z
PBHV9115Z
BLT81