PBSS303PZ: 30 V, 5.3 A PNP low VCEsat (BISS) transistor _ BDTIC a Leading Distributor in China

PBSS303PZ: 30 V, 5.3 A PNP low VCEsat (BISS) transistor

PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT223 (SC-73) small Surface-Mounted Device (SMD) plastic package.

NPN complement: PBSS303NZ.

PBSS303PZ: Product Block Diagram

PBSS303PZ: Block Diagram

SOT223

Data Sheets (1)

Name/Description	Modified Date
30 V, 5.3 A PNP low VCEsat (BISS) transistor (REV 2.0) PDF (164.0 kB) PBSS303PZ	10 Dec 2009

Application Notes (1)

Name/Description	Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076	12 Jul 2011

Package Information (1)

Name/Description	Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223	08 Feb 2016

Packing (1)

Name/Description	Modified Date
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135	07 Nov 2012

Reliability and Quality Information (2)

Name/Description	Modified Date
PBSS303PZ NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBSS303PZ_1	31 Jan 2015
PBSS303PZ NXP Product Quality (REV 1.2) PDF (74.0 kB) PBSS303PZ_NXP_PRODUCT_QUALITY	31 Jan 2015

Supporting Information (2)

Name/Description	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE	30 Sep 2013

SPICE model

PBSS303PZ SPICE model (REV 1.4) prm PBSS303PZ_1_2 7/22/2012

Ordering Information

Product	Status	Package version	Package name	Size (mm)	Transistor polarity	transistor polarity	P_tot [max] (mW)	number of transistors	V_CEO [max] (V)	I_C [max] (A)	I_CM [max] (A)	h_FE [min]	h_FE [typ]	f_T [typ] (MHz)	R_CEsat [typ] (mΩ)	V_CEsat [max] (mV)	R_CEsat [max] (mΩ)
PBSS303PZ	Active	SOT223	SC-73	6.5 x 3.5 x 1.65		PNP	700	1	-30	-5.3	-10.6	250	400	130	0.0360.061	-35	53

Package Information

Product ID	Package Description	Outline Version	Reflow/Wave Soldering	Packing	Product Status	Part NumberOrdering code(12NC)	Marking	Chemical Content	RoHS / Pb Free / RHF	LeadFree Conversion Date	EFR	IFR(FIT)	MTBF(hour)	MSL	MSL LF
PBSS303PZ		SOT223	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 11¼" Q1/T1 in LargePack	Active	PBSS303PZ,135 (9340 590 51135)	S303PZ	PBSS303PZ		Always Pb-free	153.0	0.71	1.41E9	1	1

30 V, 5.3 A PNP low VCEsat (BISS) transistor PBSS303PZ

Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z

PBSS303PZ NXP® Product Reliability PBSS303PZ

PBSS303PZ NXP Product Quality PBSS303PZ

PBSS303PZ SPICE model PBSS303PZ

plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55

PBHV9115Z

PBHV9115Z

BLT81

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