PMEG2010AEB: 20 V, 1 A low VF MEGA Schottky barrier rectifier in SOD523 package
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD523 (SC-79) ultra small plastic SMD package.
PMEG2010AEB: Product Block Diagram
sod523_3d
Data Sheets (1)
| Name/Description | Modified Date |
|---|---|
| 20 V, 1 A ultra low VF MEGA Schottky barrier rectifier in SOD523 package (REV 1.0) PDF (108.0 kB) PMEG2010AEB | 03 Dec 2003 |
Selector Guides (1)
| Name/Description | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 | 17 Feb 2016 |
Package Information (1)
| Name/Description | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (174.0 kB) SOD523 | 08 Feb 2016 |
Packing (2)
| Name/Description | Modified Date |
|---|---|
| Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (179.0 kB) SOD523_115 | 07 Nov 2012 |
| Tape reel; standard product orientation 12NC ending 135 (REV 1.0) PDF (179.0 kB) SOD523_135 | 07 Nov 2012 |
Reliability and Quality Information (2)
| Name/Description | Modified Date |
|---|---|
| PMEG2010AEB NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG2010AEB_1 | 31 Jan 2015 |
| PMEG2010AEB NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG2010AEB_NXP_PRODUCT_QUALITY | 31 Jan 2015 |
Supporting Information (1)
| Name/Description | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE | 30 Sep 2013 |
SPICE model
- PMEG2010AEB SPICE model (REV 1.4) prm PMEG2010AEB_1_2 7/22/2012
Ordering Information
| Product | Status | Package version | Package name | Size (mm) | IF (A) | VR (V) | Configuration | IR [max] (mA) | IFSM [max] (A) | Cd [max] (pF) | VF [max] (mV) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG2010AEB | Active | SOD523 | SOD523 | 1.2 x 0.8 x 0.6 | 1 | 20 | single | 1,5@VR=20V | 6 | 30@VR=1V | 290@IF=0,1A |
| PMEG2010AEB/DG | No Longer Manufactured | SOD523 | SOD523 | 1.2 x 0.8 x 0.6 | 1 | 20 | single | 1,5@VR=20V | 6 | 30@VR=1V | 290@IF=0,1A |
Package Information
| Product ID | Package Description | Outline Version | Reflow/Wave Soldering | Packing | Product Status | Part NumberOrdering code(12NC) | Marking | Chemical Content | RoHS / Pb Free / RHF | LeadFree Conversion Date | EFR | IFR(FIT) | MTBF(hour) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMEG2010AEB | | SOD523 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMEG2010AEB,115 (9340 577 57115) | L6 | PMEG2010AEB |    | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |
| Reel 11¼" Q1/T1 in LargePack | Active | PMEG2010AEBF (9340 577 57135) | L6 | PMEG2010AEB | 157.0 | 0.73 | 1.37E9 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- PMEG2010AEB NXP® Product Reliability PMEG2010AEB
- PMEG2010AEB NXP® Product Quality PMEG2010AEB
- PMEG2010AEB SPICE model PMEG2010AEB
- plastic surface-mounted package; 2 leads pesd5z7.0
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel; standard product orientation 12NC ending 115 pesd5z7.0
- Tape reel; standard product orientation 12NC ending 135 pesd5z5.0
- PMEG2010AEB
- BB208-02
