RB520CS3002L: 200 mA low VF MEGA Schottky barrier rectifier

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in DFN1006-2 (SOD882) leadless ultra small Surface-Mounted Device (SMD) plastic package.

sod882_3d
Data Sheets (1)
Name/DescriptionModified Date
200 mA low VF MEGA Schottky barrier rectifier (REV 1.0) PDF (199.0 kB) RB520CS3002L [English]25 Jun 2013
Selector Guides (1)
Name/DescriptionModified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
Package Information (1)
Name/DescriptionModified Date
DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 [English]08 Feb 2016
Packing (1)
Name/DescriptionModified Date
Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 [English]07 Nov 2012
Reliability and Quality Information (2)
Name/DescriptionModified Date
RB520CS3002L NXP® Product Reliability (REV 1.1) PDF (83.0 kB) RB520CS3002L_1 [English]31 Jan 2015
RB520CS3002L NXP Product Quality (REV 1.2) PDF (74.0 kB) RB520CS3002L_NXP_PRODUCT_QUALITY [English]31 Jan 2015
Supporting Information (1)
Name/DescriptionModified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE model
Ordering Information
ProductStatusPackage versionPackage nameSize (mm)VR [max] (V)IF [max] (mA)IFSM [max] (A)ConfigurationVF [max] (mV)Cd [max] (pF)IR [max] (mA)IR [max] (µA)
RB520CS3002LActiveSOD882DFN1006-21.0 x 0.6 x 0.5302003single640100.5
Package Information
Product IDPackage DescriptionOutline VersionReflow/Wave SolderingPackingProduct StatusPart NumberOrdering code(12NC)MarkingChemical ContentRoHS / Pb Free / RHFLeadFree Conversion DateEFRIFR(FIT)MTBF(hour)MSLMSL LF
RB520CS3002LSOD882Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActiveRB520CS3002LYL (9340 678 37315)ZARB520CS3002LAlways Pb-free157.00.731.37E911
200 mA low VF MEGA Schottky barrier rectifier RB520CS3002L
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
RB520CS3002L NXP® Product Reliability RB520CS3002L
RB520CS3002L NXP Product Quality RB520CS3002L
RB520CS3002L SPICE model RB520CS3002L
DFN1006-2: leadless ultra small plastic package; 2 terminals pesd9x7.0l
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 315 pesd9x7.0l
1PS10SB82