UJA1075TW: UJA1075TW

sot549-1_3d
Package Information (1)
Name/DescriptionModified Date
plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die... (REV 1.0) PDF (380.0 kB) SOT549-108 Feb 2016
Ordering Information
ProductStatusProduct categorySupported standardsPackage nameLow power modesSupply voltage [min] (V)Supply voltage [max] (V)Data rate [min] (kb/s)Data rate [max] (kb/s)CAN channelsLIN channelsVoltage on bus pins [min] (V)Voltage on bus pins [max] (V)VESD IEC61000-4-2 (kV)VESD HBM on bus pins (+/- kV)VIO option availableApplicationRecommended Version
UJA1075TW/5V0No Longer ManufacturedHTSSOP32
UJA1075TW/3V3No Longer ManufacturedHTSSOP32
UJA1075TW/5V0/WDNo Longer ManufacturedHTSSOP32
UJA1075TW/3V3/WDNo Longer ManufacturedHTSSOP32