Name/Description | Modified Date |
---|---|
plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die... (REV 1.0) PDF (380.0 kB) SOT549-1 | 08 Feb 2016 |
Product | Status | Product category | Supported standards | Package name | Low power modes | Supply voltage [min] (V) | Supply voltage [max] (V) | Data rate [min] (kb/s) | Data rate [max] (kb/s) | CAN channels | LIN channels | Voltage on bus pins [min] (V) | Voltage on bus pins [max] (V) | VESD IEC61000-4-2 (kV) | VESD HBM on bus pins (+/- kV) | VIO option available | Application | Recommended Version |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
UJA1075TW/5V0 | No Longer Manufactured | HTSSOP32 | ||||||||||||||||
UJA1075TW/3V3 | No Longer Manufactured | HTSSOP32 | ||||||||||||||||
UJA1075TW/5V0/WD | No Longer Manufactured | HTSSOP32 | ||||||||||||||||
UJA1075TW/3V3/WD | No Longer Manufactured | HTSSOP32 |