MBRAF3200: 200 V, 3.0 A Schottky Rectifier
This device employs the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system.
Features- Small Compact Surface Mountable Package with J-Bend Leads
- Rectangular Package for Automated Handling
- Highly Stable Oxide Passivated Junction
- Very High Blocking Voltage - 200 V
- 150°C Operating Junction Temperature
- Guard-Ring for Stress Protection
- This is a Pb-Free DeviceMechanical Characteristics:
- Case: Epoxy, Molded, Epoxy Meets UL 94, V-0
- Weight: 95 mg (approximately)
- Finish: All External Surfaces Corrosion Resistant and TerminalLeads are Readily Solderable
- Lead and Mounting Surface Temperature for Soldering Purposes:260°C Max. for 10 Seconds
- Cathode Polarity Band
- Device Meets MSL 1 Requirements
- ESD Ratings: Machine Model = A Human Body Model = 1B
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Simulation Models (4)
Package Drawings (1)
| Document Title | Document ID/Size | Revision |
|---|
| SMA-FL | 403AA (47.3kB) | O |
Data Sheets (1)
Order Information
| Product | Status | Compliance | Package | MSL* | Container | Budgetary Price/Unit |
|---|
| MBRAF3200T3G | Active | AEC Qualified
Pb-free
Halide free | SMA-FL | 403AA | 1 | Tape and Reel | 5000 | $0.146 |
| NRVBAF3200T3G | Active | AEC Qualified
PPAP Capable
Pb-free
Halide free | SMA-FL | 403AA | 1 | Tape and Reel | 5000 | $0.1607 |
Specifications
| Product | Configuration | VRRM Min (V) | VF Max (V) | IRM Max (µA) | IO(rec) Max (A) | IFSM Max (A) | trr Max (ns) | Cj Max (pF) |
|---|
| MBRAF3200T3G | Single | 200 | 0.84 | 1000 | 3 | 100 | - | - |
| NRVBAF3200T3G | Single | 200 | 0.84 | 1000 | 3 | 100 | - | - |
